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科研机构
北京大学 [34]
内容类型
期刊论文 [18]
其他 [16]
发表日期
2017 [1]
2016 [6]
2015 [4]
2014 [6]
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2012 [4]
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共34条,第1-10条
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专题:北京大学
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Optimization design of built-up thermal protection system based on validation of corrugated core homogenization
期刊论文
APPLIED THERMAL ENGINEERING, 2017
Ma, Yongbin
;
Xu, Baosheng
;
Chen, Mingji
;
He, Rujie
;
Wen, Weibin
;
Cheng, Tianbao
;
Fang, Daining
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2017/12/03
Thermal protection system
C/SiC composites
Corrugated core sandwich panel
Homogenization
Transient heat conduction
TRANSIENT HEAT-CONDUCTION
SANDWICH STRUCTURE
LATTICE CORE
INSULATION
CONVECTION
NANOFLUID
BEHAVIOR
Socio-economic analysis of the risk management of hexabromocyclododecane (HBCD) in China in the context of the Stockholm Convention
期刊论文
CHEMOSPHERE, 2016
Zhu, Jing
;
Liu, Jian-Guo
;
Hu, Jian-xin
;
Yi, Shan
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2017/12/03
Socio-economic analysis
Risk management of chemicals
Hexabromocyclododecane
Stockholm Convention
China
INSULATION MATERIALS
TOXICITY
Novel through-silicon vias for enhanced signal integrity in 3D integrated systems
期刊论文
Journal of Semiconductors, 2016
方孺牛
;
孙新
;
缪旻
;
金玉丰
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2017/12/03
through-silicon-vias
crosstalk
MOS capacitance
Poisson&apos
s equation
Fabrication and Characterization of Fine Pitch TSV Integration with Self-aligned Backside Insulation Layer Opening
其他
2016-01-01
Guan, Yong
;
Zeng, Qinghua
;
Chen, Jing
;
Ma, Shenglin
;
Jin, Yufeng
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2017/12/03
TSV
3D packaging
sidewall insulation
electrical properties
CMP
THROUGH-SILICON VIAS
STACKING TECHNOLOGY
LINER
Novel through-silicon vias for enhanced signal integrity in 3D integrated systems
期刊论文
半导体学报(英文版), 2016
Fang Runiu
;
Sun Xin
;
Miao Min
;
Jin Yufeng
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2017/12/03
through-silicon-vias crosstalk MOS capacitance Poisson&
s equation
through-silicon-vias
crosstalk
MOS capacitance
Poisson&
s equation
#39
#39
Thermal-Mechanical Reliability Analysis of Connection Structure between Redistribution Layer and TSV for MEMS Packaging
其他
2016-01-01
Meng, Wei
;
Zeng, Qinghua
;
Guan, Yong
;
Chen, Jing
;
Jin, Yufeng
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2017/12/03
MEMS packaging
reliability
RDL opening
copper thickness
insulation layer thickness
3D INTEGRATION
METALLIZATION
OPTIMIZATION
SILICON
COPPER
Design and analysis of the porous ZrO2/(ZrO2+Ni) ceramic joint with load bearing-heat insulation integration
期刊论文
CERAMICS INTERNATIONAL, 2016
Zhou, Wenbin
;
Zhang, Rubing
;
Fang, Daining
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2017/12/03
C. Mechanical properties
C. Thermal properties
ZrO2/(ZrO2+Ni) sandwich ceramics
Joints/joining
Finite element analysis
MECHANICAL-PROPERTIES
RESIDUAL-STRESS
FATIGUE LIFE
INTERLAYERS
COMPOSITES
SIMULATION
Preparation and thermodynamic analysis of the porous ZrO2/(ZrO2 + Ni) functionally graded bolted joint
期刊论文
COMPOSITES PART B-ENGINEERING, 2015
Zhou, Wenbin
;
Ai, Shigang
;
Chen, Mingji
;
Zhang, Rubing
;
He, Rujie
;
Pei, Yongmao
;
Fang, Daining
收藏
  |  
浏览/下载:6/0
  |  
提交时间:2017/12/03
Ceramic-matrix composites (CMCs)
Thermomechanical
Finite element analysis (FEA)
Joints/joining
FINITE-ELEMENT SIMULATION
RESIDUAL-STRESS
COMPOSITE JOINTS
DESIGN
FABRICATION
CERAMICS
PINS
Load distribution in threads of porous metal-ceramic functionally graded composite joints subjected to thermomechanical loading
期刊论文
COMPOSITE STRUCTURES, 2015
Zhou, Wenbin
;
Zhang, Rubing
;
Ai, Shigang
;
He, Rujie
;
Pei, Yongmao
;
Fang, Daining
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2017/12/03
Functionally graded composite joints
Thermomechanical
Finite element modeling
Load distribution
RESIDUAL-STRESS
ALUMINUM JOINTS
SIMULATION
Measuring residual stress and its influence on properties of porous ZrO2/(ZrO2+Ni) ceramics
期刊论文
materials science and engineering a structural materials properties microstructure and processing, 2015
Zhou, Wenbin
;
Zhou, Hao
;
Zhang, Rubing
;
Pei, Yongmao
;
Fang, Daining
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2015/11/10
Ceramic-metal functionally graded materials
Residual stresses
Nanoindentation
Finite element method
MULTILAYER THERMAL INSULATIONS
INSTRUMENTED SHARP INDENTATION
HIGH-TEMPERATURE
YOUNGS MODULUS
NANOINDENTATION
MICROSTRUCTURE
DEFORMATION
FABRICATION
DEPENDENCE
STRENGTH
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