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Study on the micro-interface behavior of 2024Al light alloy bonded by ultrasonic assisted solid phase diffusion welding with Ag interlayer under atmosphere 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2022, 卷号: 833, 页码: 10
作者:  Wang, Qian;  Nie, Yong;  Shao, Yingfeng;  Liu, Hongzhi;  Hu, Xiaoqiang
收藏  |  浏览/下载:62/0  |  提交时间:2022/03/28
Flip Chip Technologies and Their Applications in MEMS Packaging 期刊论文
International Journal of Nonlinear Sciences and Numerical Simulation, 2002, 卷号: 3, 期号: 3-4, 页码: 433-436
作者:  Wang HY(汪海英);  Bai YL(白以龙)
收藏  |  浏览/下载:1796/213  |  提交时间:2007/06/15


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