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Low temperature Al based wafer bonding using Sn as intermediate layer 其他
2012-01-01
Zhu, Zhiyuan; Yu, Min; Zhu, Yingwei; Wang, Peiquan; Liu, Chenchen; Wang, Wei; Miao, Min; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载:6/0  |  提交时间:2015/11/16
Detection of micro-Te segregation at the interface of Cu/Cr phases in Cu-30Cr-0.01Te alloy contact material by XPS 其他
2011-01-01
Xie, Jinglin; Miao, Baihe
收藏  |  浏览/下载:5/0  |  提交时间:2015/11/13
Atomic force microscopy evidence of citrate displacement by 4-mercaptopyridine on gold in aqueous solution 其他
2000-01-01
Zhang, H; He, HX; Wang, J; Liu, ZF
收藏  |  浏览/下载:2/0  |  提交时间:2015/11/11


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