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Microfluidic cooling for distributed hot-spots 其他
2016-01-01
Pi, Yudan; Wang, Wei; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03
Fabrication and Traceable Quality Evaluation of Fine Pitch TSV with Self-integrated Micro Heater and Thermocouple 其他
2016-01-01
Guan, Yong; Zeng, Qinghua; Bian, Yuan; Zhong, Xiao; Chen, Jing; Ma, Shenglin; Zhu, Yunhui; Jin, Yufeng
收藏  |  浏览/下载：7/0  |  提交时间：2017/12/03
A full chip scale numerical simulation method for thermal management of 3D IC 其他
2016-01-01
Wang, Ningyu; Jin, Yufeng; Pi, Yudan; Wang, Wei
收藏  |  浏览/下载：8/0  |  提交时间：2017/12/03
Design and Simulation of MEMS Thermal and Vibration Isolator Based on PDMS Beam Arrays 其他
2016-01-01
Xu, Kaisi; Zhu, Ningli; Cao, Shan; Su, Weiguo; Zhang, Wei; Hao, Yilong
收藏  |  浏览/下载：4/0  |  提交时间：2017/12/03
Thermal-Mechanical Reliability Assessment of TSV Structure for 3D IC Integration 其他
2016-01-01
Liu, Huan; Zeng, Qinghua; Guan, Yong; Fang, Runiu; Sun, Xin; Su, Fei; Chen, Jing; Miao, Min; Jin, Yufeng
收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03
An Accurate Calculation Method on Thermal Effectiveness of TSV and Wire 其他
2016-01-01
Pi, Yudan; Wang, Wei; Jin, Yufeng
收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03
Thermally Tunable Resonator Using Directly Integrated Metallic Heater 其他
2015-01-01
Chen, Ruobing; Li, Xinbai; Deng, Qingzhong; Michel, Jurgen; Zhou, Zhiping
收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03
Mechanical and Electrical Reliability Assessment of Bump-less Wafer-on-Wafer Integration with One-time Bottom-up TSV Filling 其他
2015-01-01
Guan, Yong; Zhu, Yunhui; Zeng, Qinghua; Ma, Shenglin; Su, Fei; Bian, Yuan; Zhong, Xiao; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03
Analysis and modeling of geometry dependent thermal resistance in silicon-on-insulator metal-oxide-semiconductor field-effect transistors 其他
2013-01-01
Zhou, Xingye; Inoue, Takuya; Kitamura, Masashi; Matsuura, Kai; Miyake, Masataka; Iizuka, Takahiro; Umeda, Takuya; Kikuchihara, Hideyuki; Mattausch, Hans Juergen; He, Jin; Miura-Mattausch, Mitiko
收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03
Generalized Thermal Design Model for Comb-Capacitor MEMS Devices Fabricated by Bonding-DRIE Process: A Preliminary Framework 其他
2013-01-01
Sun, Han; Yang, Fang; Wang, Wei; Zhang, Dacheng
收藏  |  浏览/下载：3/0  |  提交时间：2015/11/13

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