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CORC

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Synthesis of Fe75Cr5(PBC)(20) bulk metallic glasses with a combination of desired merits using industrial ferro-alloys without high-purity materials 其他
2017-01-01
Xu, Tao; Jian, Zengyun; Chang, Fange; Zhuo, Longchao; Shi, Minjie; Zhu, Man; Xu, Junfeng; Liu, Yongqin; Zhang, Tao
收藏  |  浏览/下载：110/0  |  提交时间：2017/12/03
Structural characterization of the DNA-binding mechanism underlying the copper(II)-sensing MarR transcriptional regulator 其他
2017-01-01
Zhu, Rongfeng; Hao, Ziyang; Lou, Hubing; Song, Yanqun; Zhao, Jingyi; Chen, Yuqing; Zhu, Jiuhe; Chen, Peng R.
收藏  |  浏览/下载：4/0  |  提交时间：2017/12/03
TOP METAL LAYER ELECTRO PLATING EDGE BEVEL REMOVAL IMPROVEMENT STUDY 其他
2016-01-01
Liu, Jianqiang; Wu, Hanming; Zhang, Xing; Wang, Yi; Tian, Chao; Sun, Liang
收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03
Top metal layer electro plating edge bevel removal improvement study 其他
2016-01-01
Liu, Jianqiang; Wu, Hanming; Zhang, Xing; Wang, Yi; Tian, Chao; Sun, Liang
收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03
Mechanical and Electrical Reliability Assessment of Bump-less Wafer-on-Wafer Integration with One-time Bottom-up TSV Filling 其他
2015-01-01
Guan, Yong; Zhu, Yunhui; Zeng, Qinghua; Ma, Shenglin; Su, Fei; Bian, Yuan; Zhong, Xiao; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03
A Wafer Level Through-Stack-Via Integration Process with One-time Bottom-up Copper Filling 其他
2014-01-01
Zhu, Yunhui; Ma, Shenglin; Sun, Xin; Fang, Runiu; Zhong, Xiao; Bian, Yuan; Guan, Yong; Chen, Jing; Miao, Min; Jin, Yufeng
收藏  |  浏览/下载：2/0  |  提交时间：2017/12/03
The Parasitic Effects Induced by the Contact in RRAM with MIM Structure 其他
2008-01-01
Zhang, Lijie; Huang, Ru; Wang, Albert Z. H.; Wu, Dake; Wang, Runsheng; Kuang, Yongbian
收藏  |  浏览/下载：4/0  |  提交时间：2015/11/10
Electroless copper plating on silicon surface for MEMS 其他
2004-01-01
Li, Y; Li, ZH; Hao, YL; Yan, GZ; Wu, WG; Han, X
收藏  |  浏览/下载：3/0  |  提交时间：2015/11/13
Combination of MEMS processing and electroless copper plating for a novel RF inductor 其他
2004-01-01
Li, Y; Wu, WG; Hao, YL
收藏  |  浏览/下载：2/0  |  提交时间：2015/11/13
Electroless copper plating on silicon surface for MEMS 其他
2004-01-01
Li, Yi; Li, Zhihong; Hao, Yilong; Yan, Guizhen; Wu, Wengang; Han, Xiang
收藏  |  浏览/下载：2/0  |  提交时间：2015/11/13

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