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Design a Modified Bi-directional Converter for Solar LED Lighting System 会议论文
作者:  Wang, Yiwang;  Chen, Xiaogao;  Tang, Houjun;  Yang, Yong;  Wen, Huiqing
收藏  |  浏览/下载：15/0  |  提交时间：2019/11/19
Study of ultraviolet assisted cure mechanism of the phosphor/silicone composites used in White LEDs 会议论文
Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018
作者:  Wang, Z.;  Fan, J.;  Liu, J.;  Hu, A.;  Qian, C.
收藏  |  浏览/下载：11/0  |  提交时间：2019/12/30
Lifetime Prediction Based On Analytical Multi-Physics Simulation for Light-Emitting Diode (LED) Systems 会议论文
18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Dresden, GERMANY, 2017-04-03
作者:  Yang, Xi;  Wang, Zili;  Ren, Yi;  Sun, Bo;  Qian, Cheng
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/30
Application of Nano Silver Sintering Technique on the Chip Bonding for Flip-chip and Vertical Light Emitting Diodes 会议论文
作者:  Tao, Mian;  Mei, Yun-Hui;  Lee, S. W. Ricky;  Yun, Feng;  Lu, Guo-Quan
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/02
Improved thermal design of fin heat sink for high-power LED lamp cooling 会议论文
作者:  Huang, Yicang;  Shen, Shengnan;  Li, Hui;  Gu, Yunjie
收藏  |  浏览/下载：8/0  |  提交时间：2019/12/05
Research on the high-brightness traffic variable message sign based on laser diodes 会议论文
applied optics and photonics, china: advanced display technology; and micro/nano optical imaging technologies and applications, aopc 2015, beijing, china, 2015-05-05
作者:  Feng, Li-Li;  Huang, Hai-Tao;  Ruan, Chi
收藏  |  浏览/下载：15/0  |  提交时间：2016/01/14
Comparison of thermal characteristics of Light-emitting Diode chips and electrical heating source 会议论文
16 int conf elect packaging technology, Chinese Inst Elect,China IEEE Component Packaging, & Mfg Tech Soci IEEE-C, Changsha, PEOPLES R CHINA, 2015-08-11
作者:  Wang, Xiaodong;  Zhou, Chuanpeng;  Li, Congming;  Li, Zhixin;  Luo, Yi
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/09
A silicon-aluminum micro heat sink for light emitting diode (LED) chips 会议论文
16 int conf elect packaging technology, Chinese Inst Elect,China IEEE Component Packaging, & Mfg Tech Soci IEEE-C, Changsha, PEOPLES R CHINA, 2015-08-11
作者:  Luo, Yi;  Yu, Beike;  Shan, Qing;  Wang, Xiaodong
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/09
Optical Radiation Patterns(ORPs) created on Light Emitting Diodes by Large Scale Microfabrication Methods 会议论文
作者:  Duo Liu;  Xianang Xu
收藏  |  浏览/下载：7/0  |  提交时间：2019/12/31
Wafer-Level light emitting diode (WL-LED): An innovative approach for cost-effective very high power lighting 会议论文
作者:  Cai, Y.;  Zhang, Y. B.;  Xu, F.;  Zhao, D. S.;  Huang, H. J.
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/02

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