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科研机构
力学研究所 [3]
北京大学 [3]
西安交通大学 [3]
清华大学 [2]
北京航空航天大学 [2]
兰州理工大学 [1]
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会议论文 [15]
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Experimental investigation of drop evaporation in microgravity onboard Chinese Satellite SJ10
会议论文
Washington, DC, United states, October 21, 2019 - October 25, 2019
作者:
Liu QS(刘秋生)
;
Xu GF(徐国峰)
;
Zhu ZQ(朱志强)
;
Liu WJ(刘文军)
;
Zhao DD(赵冬冬)
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2020/11/20
Droplet evaporation
Marangoni effect
Microgravity
Phase change
Recoverable satellite
Space experiment
Effect of bonding agent production materials on the mechanical properties of composite solid rocket propellant
会议论文
MATEC Web of Conferences
作者:
Elall, A.M.A.
;
Lin, G.
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/12/30
Adhesives
Chlorine compounds
Composite propellants
Copper compounds
Manufacture
Rockets
Solid propellants
Strain
Composite solid propellant
Effect of solvents
Environmental conditions
Interfacial interaction
Loading condition
Polar solvents
Properties of composites
Solid particles
Mechanical properties
Effects of Bulk Pre-stress on Interfacial Breakdown Voltage in XLPE/SIR laminate
会议论文
作者:
Wang Xia
;
Zhang Yuwei
;
Zhang Wenhui
;
Wu Kai
;
Zhang Chong
收藏
  |  
浏览/下载:6/0
  |  
提交时间:2019/11/26
interfacial charge
SIR
interfacial breakdown
XLPE
bulk prestress
Thermal-Mechanical Reliability Assessment of TSV Structure for 3D IC Integration
会议论文
18th IEEE Electronics Packaging Technology Conference (EPTC), Singapore, SINGAPORE, 2016-11-30
作者:
Liu, Huan
;
Zeng, Qinghua
;
Guan, Yong
;
Fang, Runiu
;
Sun, Xin
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/12/30
Chip scale packages
Electronics packaging
Failure (mechanical)
Fatigue of materials
Finite element method
Shear stress
Soldering
Stresses
Thermal load
Timing circuits
Global simulation
Interfacial failures
Load condition
Maximum principal stress
Resistance measurement
Solder balls
Thermal mechanical stress
Thermal-mechanical reliability
Three dimensional integrated circuits
Effect of the crack surface friction on the field strength of bi-material-interfacial crack
会议论文
Alicante, Spain, September 14, 2016 - September 16, 2016
作者:
Li, Youtang
;
Liu, Lei
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  |  
浏览/下载:1/0
  |  
提交时间:2020/11/15
Crack propagation
Finite element method
Friction
Stress intensity factors
Crack surface friction
Crack tip displacement
Displacement field
Effective stress
Friction coefficients
Friction factors
Interfacial cracks
Practical engineering
Multi-interfacial contact behaviours of an axle roller bearing assembly of railroad cars
会议论文
作者:
Guo, L.L.
;
Xi, H.
;
Chang, W.
;
Yan, J.S.
;
Hu, X.
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/12/02
Axle bearing
Bearing assemblies
Clearance difference
Contact Mechanics
Contact performance
Interfacial contact
Manufacturing technologies
Operating condition
Research on interfacial cracking of a Cr coating/steel substrate with and without laser pre-quenching treatment under thermal fatigue loading
会议论文
3rd International Conference on Digital Manufacturing and Automation, ICDMA 2012, Guangxi, China, AUG 01-02, 2012
作者:
Yang BQ(杨班权)
;
Chen GN(陈光南)
;
Chen XJ(陈学军)
;
Sun WH
;
Chen HQ
收藏
  |  
浏览/下载:24/0
  |  
提交时间:2013/02/26
Chromate coatings
Chromium
Manufacture
Quenching
Substrates
Thermal fatigue
Interfacial adhesions
Interfacial cracking
Loading condition
Steel substrate
Substrate surface
Characteristics on Surface flashover of polyethylene nanocomposites film in vacuum
会议论文
作者:
Wang, Weiwang
;
Li, Shengtao
;
Tang, Fan
;
Li, Jianying
收藏
  |  
浏览/下载:1/0
  |  
提交时间:2019/12/10
nanocomposites
interfacial region
polyethylene
surface flashover
Determination and Numerical Studies for Insulation Interfacial Pressure of HV Cable Termination
会议论文
Asia-Pacific Power and Energy Engineering Conference (APPEEC), 2011-03-25
作者:
Ma Yong-qi[1]
;
Zheng Ping[2]
;
Han Xuan[3]
;
Xu Cao[4]
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/04/30
insulation condition
cable termination
interfacial pressure
measurement
numerical simulation
A study on the heat transfer coefficient for high pressure die casting process of ADC12Z alloy
会议论文
LIGHT METALS 2007, Symposium on Light Metals held at the 2007 TMS Annual Meeting and Exhibition, Orlando, FL, Web of Science, INSPEC
Zhi-Peng, Guo
;
Shou-Mei, Xiong
;
Bai-Cheng, Lrlj
;
Li, Mei
;
Allison, John
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  |  
浏览/下载:2/0
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