CORC

在结果中检索

CORC

浏览/检索结果: 共88条，第1-10条 帮助

限定条件    
已选(0)清除 条数/页：   排序方式：
Stress analysis and design of the waveguide bellows for EAST ECRH system 会议论文
Hangzhou, China, June 21-22, 2020
作者:  Zhang, Lingyuan;  Wang, Xiaojie;  Liu, Fukun;  Xu, Handong;  Wu, Dajun
收藏  |  浏览/下载：50/0  |  提交时间：2020/10/22
Evolution of the mechanical properties of a cobalt-based alloy under thermal shocks 会议论文
作者:  Wen, Junxia;  Che, Hongyan;  Cao, Rui;  Dong, Hao;  Ye, Youxiong
收藏  |  浏览/下载：2/0  |  提交时间：2020/12/18
Design and Test of Flexible Support Structure for Large Aperture Lightweight Mirror 会议论文
Beijing, PEOPLES R CHINA, 2020-11-30
作者:  Sun Li Jun;  Liu Zhen;  Zhang Zhao Hui;  Li Li Bo;  Li Si Yuan
收藏  |  浏览/下载：31/0  |  提交时间：2021/06/04
The research progress on strengthen property and mechanism of warm laser shock peening 会议论文
Shanghai, China, October 17-20, 2020
作者:  Yang YQ(杨玉奇);  Zhao JB(赵吉宾);  Qiao HC(乔红超);  Wu JJ(吴嘉俊);  Hu XL(胡宪亮)
收藏  |  浏览/下载：5/0  |  提交时间：2021/01/17
Uncertainties in pressurized thermal shock analyses 会议论文
San Antonio, TX, United states, July 14, 2019 - July 19, 2019
作者:  Niffenegger M;  Garrido OC;  Mora DF;  Qian GA(钱桂安);  Mukin R
收藏  |  浏览/下载：16/0  |  提交时间：2020/11/20
Design of Spatial Oval Plane Mirror and Its Support Structure 会议论文
Nanjing, PEOPLES R CHINA, 2017-10-24
作者:  Chai Wenyi;  Hu Yongming;  Wang Chenjie;  Chen Su;  Feng Song
收藏  |  浏览/下载：35/0  |  提交时间：2018/07/05
Surface modification of nano-size SiO2 filler for flip chip underfill applications 会议论文
Harbin
作者:  Gang Li;  yachuan He;  Pengli Zhu;  Tao Zhao;  Rong Sun
收藏  |  浏览/下载：37/0  |  提交时间：2018/02/02
Effects of Thermal and Mechanical Combined Load on Blade Stress and Fatigue Life Characteristic 会议论文
作者:  Lin, Hao;  Geng, Haipeng;  Li, Hao;  Xu, Xiangming;  Du, Tingchen
收藏  |  浏览/下载：7/0  |  提交时间：2019/11/26
Stress intensity factor of interface crack in the cermet cladding material structure under steady mechanical-thermal coupled loads 会议论文
International Conference on Material Science and Engineering, ICMSE 2016, June 24, 2016 - June 26, 2016
作者:  Yang, Junru;  Chi, Yurong;  Wang, Minglan;  Zhu, Ran
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/31
Numerical simulation of thermo-mechanical behavior in high power diode laser arrays 会议论文
17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16
作者:  Lu, Yao;  Nie, Zhiqiang;  Zhang, Pu;  Wang, Zhenfu;  Xiong, Lingling
收藏  |  浏览/下载：44/0  |  提交时间：2016/11/22

©版权所有 ©2017 CSpace - Powered by CSpace