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The Performance Investigation of Junctionless Transistor by Considering Different Recessed Gates 会议论文
Shenzhen, China, June 6, 2018 - June 8, 2018
作者:  Lou, Haijun;  Li, Wentao;  Yang, Yumei;  Lin, Xinnan
收藏  |  浏览/下载：2/0  |  提交时间：2020/11/15
Surface passivation of 1550nm AlxInyAsSb avalanche photodiode 会议论文
Beijing, China, 2018-10-11
作者:  Guo, Chunyan;  Lv, Yuexi;  Zheng, Da'nong;  Sun, Yaoyao;  Jiang, Zhi
收藏  |  浏览/下载：44/0  |  提交时间：2018/12/21
THE COUNTERACTIVE FLOW AND HEAT TRANSFER IN A NARROW STRAIGHT CHANNEL WITH SIDEWALL BLEEDING SLOTS 会议论文
PROCEEDINGS OF THE ASME TURBO EXPO: TURBOMACHINERY TECHNICAL CONFERENCE AND EXPOSITION, 2018, VOL 5A, 2018-01-01
作者:  Qiu, Lu;  Chen, Yanan;  Deng, Hongwu;  Zhu, Jianqin
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/30
A Study on Inductively Coupled Plasma Etch Rate of HgCdTe at Cryogenic Temperature 会议论文
作者:  Liu FL;  Chen YY;  Ye ZH;  Ding RJ;  He L
收藏  |  浏览/下载：16/0  |  提交时间：2018/11/20
Efficient Algorithm for Sidewall Machining of Aircraft Structural Part 会议论文
3RD INTERNATIONAL CONFERENCE ON MECHANICAL ENGINEERING AND AUTOMATION SCIENCE (ICMEAS 2017), 2017-01-01
作者:  Zheng, Zujie;  Zheng, Guolei;  Jiang, Zheng;  Wu, Xiaofeng
收藏  |  浏览/下载：16/0  |  提交时间：2019/12/30
Formation of Polymer Insulation Layer (Liner) on Through Silicon Vias (TSV) with High Aspect Ratio over 5:1 by Direct Spin Coating 会议论文
2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), Las Vegas, NV
作者:  Li, Liyi;  Tuan, Chia-Chi;  Moon, Kyoung-Sik;  Zhang, Guoping;  Sun, Rong
收藏  |  浏览/下载：37/0  |  提交时间：2017/01/15
Fabricating Polymer Insulation Layer by Spin-coating for Through Silicon Vias 会议论文
IEEE Electronic Components and Technology Conference（ECTC）, 美国
作者:  Guoping Zhang;  Kun Jiang;  Qiang Liu;  Jinhui Li;  Rong Sun
收藏  |  浏览/下载：17/0  |  提交时间：2016/01/27
Natural convection heat transfer of copper-water nanofluid in a square cavity with time-periodic boundary temperature 会议论文
作者:  Wang, G.;  Meng, X.;  Zeng, M.;  Ozoe, H.;  Wang, Q.W.
收藏  |  浏览/下载：0/0  |  提交时间：2020/11/15
Sidewall roughness measurement for shallow silicon etching based on atomic force microscope 会议论文
osa topical conference:the 4th advances in optoelectronics and micro/nano-optics, xi’an, china, 2014-09
作者:  Lei Wan;  Xuan Li;  Ning Zhu;  Rui-ying Zhang;  Ting Mei
收藏  |  浏览/下载：11/0  |  提交时间：2015/05/25
O2 plasma treatment in polymer insulation process for through silicon vias 会议论文
Proceedings of the Electronic Packaging Technology Conference, EPTC,, 中国
作者:  Zhuang, Lulu;  Jiang, Kun;  Zhang, Guoping;  Tang, Jiaoning;  Sun, Rong
收藏  |  浏览/下载：20/0  |  提交时间：2015/09/01

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