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De-oiling Test of New Type Cyclone for Treatment of Wastewater Containing Polymer 会议论文
Xiamen, China, 26 December 2020 - 27 December 2020
作者:  Wang,Qiang;  Li,Guisheng;  Li,Deqiang;  Li,Gang;  Zhang J(张军)
收藏  |  浏览/下载：106/0  |  提交时间：2021/06/21
Injection profile inversion timing judgment model for polymer flooding and its theoretical validation 会议论文
2ND INTERNATIONAL CONFERENCE ON FRONTIERS OF MATERIALS SYNTHESIS AND PROCESSING, 2019-01-01
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收藏  |  浏览/下载：5/0  |  提交时间：2020/01/03
Understanding the Enhancement of Young's modulus of Macroscopic Carbon Nanotube Fibers After Polymer Infiltration 会议论文
PROCEEDINGS OF THE EUROPE/AFRICA CONFERENCE DRESDEN 2017 - POLYMER PROCESSING SOCIETY PPS, 2019-01-01
作者:  Mas, Bartolome;  Monreal-Bernal, Alfonso;  Yue, Hangbo;  Zhang, Haiquin;  Vilatela, Juan J.
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/30
Bio-inspired Nanowire Arrays as Artificial Photoreceptors for Retinal Prosthesis 会议论文
曲阜, 2017.7.2
作者:  Jing Tang;  Nan Qin;  Yan Chong;  Yian Huang;  Yupu Diao
收藏  |  浏览/下载：99/0  |  提交时间：2017/12/28
A dual-structural Ferroelectret System for Force Sensing 会议论文
Chengdu, China, 14-18 September, 2017, 2017
作者:  Peng Fang;  Xingchen Ma;  Xiaoqing Zhang;  Feipeng Wang;  Guanglin Li
收藏  |  浏览/下载：15/0  |  提交时间：2018/02/02
Surface modification of nano-size SiO2 filler for flip chip underfill applications 会议论文
Harbin
作者:  Gang Li;  yachuan He;  Pengli Zhu;  Tao Zhao;  Rong Sun
收藏  |  浏览/下载：37/0  |  提交时间：2018/02/02
Effects of oxygen plasma treatment on domestic aramid fiber III reinforced bismaleimide composite interfacial properties 会议论文
1ST INTERNATIONAL CONFERENCE ON FRONTIERS OF MATERIALS SYNTHESIS AND PROCESSING (FMSP 2017), 2017-01-01
作者:  Shi, Chen;  Wang, Jing;  Chen, Ping;  Feng, Jiayue;  Cui, Jinyuan
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/03
Research on process and simulation of the isothermal forging of a spur bevel gear 会议论文
1st International Conference on Composite Material, Polymer Science and Engineering, CMPSE 2017, 24 June 2017 through 25 June 2017
作者:  Zhao, Xinhai;  Zhao, Liangang;  Tian, Zhirui;  Liu, Chuanjin;  Wu, Xianghong
收藏  |  浏览/下载：7/0  |  提交时间：2019/12/31
Underfill Technology for Fine Pitch Flip Chip Application 会议论文
The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China
作者:  Pengli Zhu;  Gang Li;  Qian Guo;  Tao Zhao;  Daoqiang Lu
收藏  |  浏览/下载：43/0  |  提交时间：2017/01/15
Formation of Polymer Insulation Layer (Liner) on Through Silicon Vias (TSV) with High Aspect Ratio over 5:1 by Direct Spin Coating 会议论文
2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), Las Vegas, NV
作者:  Li, Liyi;  Tuan, Chia-Chi;  Moon, Kyoung-Sik;  Zhang, Guoping;  Sun, Rong
收藏  |  浏览/下载：37/0  |  提交时间：2017/01/15

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