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Thermally accelerated ageing test of 808nm high power diode laser arrays in CW mode 会议论文
17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16
作者:  Nie, Zhiqiang;  Wu, Di;  Lu, Yao;  Wu, Dhai;  Wang, Shuna
收藏  |  浏览/下载：86/0  |  提交时间：2016/11/22
Thermal behavior of microchannel cooled high power diode laser arrays 会议论文
17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16
作者:  Wu, Dihai;  Zhang, Pu;  Nie, Zhiqiang;  Xiong, Lingling;  Song, Yunfei
收藏  |  浏览/下载：33/0  |  提交时间：2016/11/22
Tensile Strength of Forged Ti-6Al-4V Welded Joints by Electronic Beam Welding 会议论文
International Conference on Civil Engineering and Building Materials (CEBM), Kunming, PEOPLES R CHINA, 2011-01-01
作者:  Qi Hongyu;  Xie Jian;  Pan Dong;  Li Shaolin;  Yang Xiaoguang
收藏  |  浏览/下载：1/0  |  提交时间：2020/01/06

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