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浏览/检索结果: 共4条，第1-4条 帮助 限定条件 内容类型：会议论文     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Study on Liquid-Solid Electromigration in Cu/Sn-9Zn/Cu Interconnect Using Synchrotron Radiation Real-Time in Situ Imaging Technology 会议论文 14th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Dalian, PEOPLES R CHINA, 2013-08-11 作者:  Huang, Mingliang;  Zhang, Zhijie;  Zhao, Ning;  Feng, Xiaofei 收藏  |  浏览/下载：7/0  |  提交时间：2019/12/11 liquid-solid electromigration (L-S EM)  Sn-9Zn solder  intermetallic compound (IMC)  reverse polarity effect  synchrotron radiation real-time in situ imaging technology   Effect of surface finish (OSP and ENEPIG) on failure mechanism induced by electromigration in Sn-3.0Ag-0.5Cu flip chip solder interconnect 会议论文 2011 International Symposium on Advanced Packaging Materials, APM 2011, Xiamen, 2011-10-25 作者:  Huang M.;  Chen L.;  Zhou S.;  Ye S. 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/18 Effect of electromigration on intermetallic compound formation in Cu/Sn/Cu interconnect 会议论文 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009, Beijing, 2009-08-10 作者:  Chen L.D.;  Huang M. 收藏  |  浏览/下载：1/0  |  提交时间：2019/12/24 Phase field simulation of solidification behavior and microstructure evolution of Sn-58Bi/Cu solder interconnect during reflow soldering proc (EI收录) 会议论文 Proceedings - 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, Dalian, China, August 11, 2013 - August 14, 2013 作者:  Ma, Wen-Jing[1];  Ke, Chang-Bo[1];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/15 Anisotropy  Electronics packaging  Flip chip devices  Microstructure  Morphology  Soldering  Soldering alloys  Solidification  Undercooling