CORC

在结果中检索

CORC

浏览/检索结果: 共50条，第1-10条 帮助

限定条件    
已选(0)清除 条数/页：   排序方式：
Study on adhesive curing process and bonding property of XM-31 silicone rubber 会议论文
Shanghai, China, 2021-10-28
作者:  Zheng, Xiangke;  Wang, Peng;  Kang, Shifa;  Duan, Zhanjun;  Jia, Xin
收藏  |  浏览/下载：81/0  |  提交时间：2022/03/18
Research on remelting phenomena and metal joining of fused-coating additive manufacturing 会议论文
作者:  Wang, X.;  Du, J.;  Wei, Z.Y.;  Zhao, G.X.;  Ren, C.Q.
收藏  |  浏览/下载：11/0  |  提交时间：2019/11/19
Understanding the vibrational structure, ring-opening kinetics of oxazine ring, hydrogen bonding system and smart ortho-structure molecular design of higher performance polybenzoxazines 会议论文
ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 2018-03-18
作者:  Han, Lu[1];  Zhang, Kan[2];  Froimowicz, Pablo[3];  Iguchi, Daniela[4];  Gil, Phwey[5]
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/24
Thermal shock behavior and bonding strength of mosi2-bao-al2o3-sio2 gradient porous coating with polymethyl methacrylate addition for porous fibrous insulations 会议论文
10th China International Conference on High-Performance Ceramics, CICC 2017, November 4, 2017 - November 7, 2017
作者:  Su, Ya Yu;  Li, Xiao Lei;  Tang, Hui Jie;  Zhao, Zhi Hao;  He, Jian
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/31
Packaging IGBT modules by rapid sintering of nanosilver paste in a current way 会议论文
2017 international conference on electronics packaging, icep 2017, tendo, yamagata, japan, 2017-04-19
作者:  Xie, Yijing;  Mei, Yunhui;  Feng, Shuangtao;  Zhang, Pu;  Zhang, Long
收藏  |  浏览/下载：99/0  |  提交时间：2017/07/18
Progress in Ultrasonic Bonding Wire Process and Quality Evaluation of Bonding Point 会议论文
作者:  Zhao ZL;  Mo DF;  Wu JR;  Jiang MD;  Zhang JL
收藏  |  浏览/下载：30/0  |  提交时间：2018/11/20
Complete indium-free CW 200W passively cooled high power diode laser array using double-side cooling technology 会议论文
components and packaging for laser systems iii 2017, san francisco, ca, united states, 2017-01-31
作者:  Wang, Jingwei;  Zhu, Pengfei;  Liu, Hui;  Liang, Xuejie;  Wu, Dihai
收藏  |  浏览/下载：77/0  |  提交时间：2017/06/08
Sintering process of mixed solvent system frit to improve the performance of the film in glass/glass laser bonding 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Li, Yi[1];  Tian, Rui[2];  Yin, Luqiao[3];  Zhang, Jianhua[4]
收藏  |  浏览/下载：4/0  |  提交时间：2019/04/24
Experimental analysis of high temperature PEEK materials on 3D printing test 会议论文
Changsha, Hunan, China, January 14, 2017 - January 15, 2017
作者:  Xiaoyong, Sun;  Liangcheng, Cao;  Honglin, Ma;  Peng, Gao;  Zhanwei, Bai
收藏  |  浏览/下载：18/0  |  提交时间：2018/03/16
High Power Diode Laser Array Development using Completely Indium Free Packaging Technology with Narrow Spectrum 会议论文
conference on components and packaging for laser systems ii, san francisco, ca, 2016-02-16
作者:  Hou, Dong;  Wang, Jingwei;  Gao, Lijun;  Liang, Xuejie;  Li, Xiaoning
收藏  |  浏览/下载：15/0  |  提交时间：2016/10/18

©版权所有 ©2017 CSpace - Powered by CSpace