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浏览/检索结果: 共4条，第1-4条 帮助 限定条件 内容类型：会议论文     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Effects of Bath Temperature on Co-electroplating Au-Sn Alloys for Electronic Packaging 会议论文 17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA, 2016-08-16 作者:  Tang, Fangwu;  Huang, Mingliang;  Huang, Feifei 收藏  |  浏览/下载：2/0  |  提交时间：2019/12/09 bath temperaturet  co-electroplating  Au-Sn alloys  electrochemical behavior   Development of a stable non-cyanide gold-tin electroplating solution for optoelectronic applications 会议论文 17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA, 2016-08-16 作者:  Huang, Feifei;  Liu, Yawei;  Huang, Mingliang 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/09 Non-cyanide electroplating  Au-Sn alloys  high stability  Composition optimization   Effect of [Au]/[Na(2)SO(3)] Molar Ratio on Co-electroplating Au-Sn Alloys in Sulfite-based Solution 会议论文 International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, PEOPLES R CHINA, 2009-08-10 作者:  Qing, Xiangyong;  Huang, Mingliang;  Pan, Jianlin 收藏  |  浏览/下载：1/0  |  提交时间：2019/12/24 Effect of [Au]/[Na2SO3] Molar Ratio on Co-electroplating Au-Sn Alloys in Sulfite-based Solution 会议论文 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), IEEE Catalog Number: CFP09553 作者:  Huang ML(黄明亮) 收藏  |  浏览/下载：1/0  |  提交时间：2019/12/24