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Building-in Reliability for VLSI (CPCI-S收录) 会议论文
2006 INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING, VOLS 1-3
作者:  Zou Xin-yao[1];  Yao Ruo-he[1]
收藏  |  浏览/下载:2/0  |  提交时间:2019/04/18
Foaming of polystyrene/supercritical CO2 in rapid decompression and cooling process (EI收录) 会议论文
Advanced Materials Research, Beijing, China, November 3, 2005 - November 5, 2005
作者:  Wu, Xiao-Dan[1,2];  Peng, Yu-Cheng[1]
收藏  |  浏览/下载:0/0  |  提交时间:2019/04/18
Comparison of bond interface reaction in Al-Ni and Al-Au systems formed by utrasonic wedge bonding (CPCI-S收录) 会议论文
2006 INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING, VOLS 1-3
作者:  Li, Mingyu[1];  Ji, Hongjun[2];  Wang, Chunqing[2]
收藏  |  浏览/下载:4/0  |  提交时间:2019/04/18
An improved second-order accurate FDTD equations at dielectric interfaces (EI收录) 会议论文
Asia-Pacific Microwave Conference Proceedings, APMC, Suzhou, China, December 4, 2005 - December 7, 2005
作者:  Ding, Hai[1,2];  Chu, Qing-Xin[1]
收藏  |  浏览/下载:0/0  |  提交时间:2019/04/18
Calculating friction force by the variation of potential on the contact surfaces during sliding (EI收录) 会议论文
American Society of Mechanical Engineers, Tribology Division, TRIB, Orlando, FL, United states, November 5, 2005 - November 11, 2005
作者:  Xu, Zhongming[1];  Huang, Ping[1]
收藏  |  浏览/下载:2/0  |  提交时间:2019/04/18
Probing process-induced defects in Si using infrared photoelastic stress measurement technique (EI收录) 会议论文
Materials Research Society Symposium Proceedings, San Francisco, CA, United states, March 28, 2005 - April 1, 2005
作者:  Liu, X.H.[1,3];  Wong, S.P.[1,3];  Peng, H.J.[1];  Ke, N.[1,3];  Zhao, Shounan[2]
收藏  |  浏览/下载:3/0  |  提交时间:2019/04/18
Effects of the insertion of InAs strain-compensating layers on photoluminescence properties of GaAsN/GaAs quantum-well structures (EI收录) 会议论文
IEEE Semiconducting and Semi-Insulating Materials Conference, SIMC, Beijing, China, September 20, 2004 - September 25, 2004
作者:  Gao, Q.[1];  Tan, H.H.[1];  Sun, B.Q.[2,5];  Gal, M.[2];  Ouyang, L.[3,6]
收藏  |  浏览/下载:4/0  |  提交时间:2019/04/18
Stress distribution in ultra thin SiO2 film/Si substrate system measured by a low level birefringence detection technique (EI收录) 会议论文
Materials Research Society Symposium Proceedings, San Francisco, CA, United states, April 13, 2004 - April 16, 2004
作者:  Liu, X.H.[1];  Peng, H.J.[1];  Wong, S.P.[1];  Zhao, Shounan[2]
收藏  |  浏览/下载:1/0  |  提交时间:2019/04/18
Building-in reliability for VLSI (EI收录) 会议论文
2006 International Conference on Electronic Materials and Packaging, EMAP, Kowloon, China, December 11, 2006 - December 14, 2006
作者:  Zou, Xin-Yao[1];  Yao, Ruo-He[1]
收藏  |  浏览/下载:0/0  |  提交时间:2019/04/18
Precipitation behavior of the lower bainitic carbide in a medium-carbon steel containing Si, Mn and Mo (CPCI-S收录) 会议论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
作者:  Liu, J.;  Luo, C. P.
收藏  |  浏览/下载:1/0  |  提交时间:2019/04/18


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