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Research on Copper Electroforming Based on Using of Nano-La2O3 会议论文
3rd International Conference on Information Computing and Applications (ICICA 2012), SEP 14-16, 2012
作者:  Li, Zhiyong;  Duan, Zhipeng;  Liu, Hongli
收藏  |  浏览/下载:3/0  |  提交时间:2019/12/31
Grain Boundary Character Distribution and Its Effect on Corrosion Resistance of Copper and Brass 会议论文
6th International Conference on Physical and Numerical Simulation of Materials Processing (ICPNS), NOV 16-19, 2010
作者:  Guo Hong;  Chen Zhiwei;  Jiang Ying;  Cai Zheng-xu
收藏  |  浏览/下载:3/0  |  提交时间:2019/12/31
Study on Mechanical Properties and Physical Properties of Copper Based Electrical Contact Materials Reinforced by CNT 会议论文
International Conference on Manufacturing Engineering and Automation, DEC 07-09, 2010
作者:  Guo, Zhongquan;  Geng, Haoran;  Feng, Shasha
收藏  |  浏览/下载:1/0  |  提交时间:2019/12/31


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