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CORC

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Distributed Parallel Stochastic Dynamic Programming Algorithm Based on MPI and Multithread for Long-term Optimal Operation of Cascaded Hydropower Stations 会议论文
The International Conference on Computer Science and Technology (CST2016)
作者:  Zhou DQ(周东清)
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/09
脐血造血干/祖细胞与脂肪干细胞共培养的作用距离研究 会议论文
第六届全国化学工程与生物化工年会, 长沙, 2010-10-29
作者:  宋克东;  刘天庆;  方美云;  石芳鑫;  马学虎
收藏  |  浏览/下载：1/0  |  提交时间：2019/12/24
Research on Foreign Exchange Risk and Enterprise 会议论文
ASCE Proceedings of the Eighth International Conference of Chinese Logistics and Transportation Professionals
作者:  Yang DQ(杨德全)
收藏  |  浏览/下载：1/0  |  提交时间：2019/12/27
ZnO nanopipes grown on InAs substrate by PLD 会议论文
第六届中国国际纳米科技研讨会, 成都, 2007-01-01
作者:  Li J(李娇);  Hu LZ(胡礼中);  Yu DQ(于东麒);  Zhang HQ(张贺秋);  Hu H(胡昊)
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/27
Zinc oxide  nanopipe  InAs  XRD  FESEM  
Optical and structural properties of catalyst-free synthesis of ZnO nanoneedle 会议论文
第六届中国国际纳米科技研讨会, 成都, 2007-01-01
作者:  Yu DQ(于东麒);  Li J(李娇);  Hu H(胡昊);  Sun JC(孙景昌);  Zhang HQ(张贺秋)
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/27
Microstructure and interface reaction between Sn-3.5Ag solder and electroplated Ni layer on Cu substrate during high temperature exposure 会议论文
International Conference on the Business of Electronic Product Reliability and Liability, Shanghai, PEOPLES R CHINA, 2004-04-27
作者:  Duan, LL;  Yu, DQ;  Han, SQ;  Zhao, J;  Wang, L
收藏  |  浏览/下载：1/0  |  提交时间：2020/01/02
Effects of Bi, Ni additives on the microstructures and wetting properties of Sn-Zn-Cu lead-free alloy 会议论文
International Conference on Asian Green Electronics - Design for Manufacturability and Reliability (2005 AGEC), Shanghai, PEOPLES R CHINA
作者:  Xie, HP;  Yu, DQ;  Wang, L
收藏  |  浏览/下载：4/0  |  提交时间：2020/01/02
The evaluation of the new composite lead free solders with the novel fabricating process 会议论文
International Conference on the Business of Electronic Product Reliability and Liability, Shanghai, PEOPLES R CHINA, 2004-04-27
作者:  Wang, L;  Yu, DQ;  Han, SQ;  Ma, HT;  Xie, HP
收藏  |  浏览/下载：3/0  |  提交时间：2020/01/02
The growth behavior of intermetallic compound layer of Sn-Ag-Cu/Cu interface during soldering 会议论文
International Conference on Asian Green Electronics - Design for Manufacturability and Reliability (2005 AGEC), Shanghai, PEOPLES R CHINA
作者:  Yu, DQ;  Wang, JH;  Wang, L
收藏  |  浏览/下载：1/0  |  提交时间：2020/01/02
The formation and growth of intermetallic compounds between Sn-3.5Ag lead-free solder and Cu substrate 会议论文
5th International Conference on Electronic Packaging Technology (ICEPT2003), Shanghai, PEOPLES R CHINA, 2003-10-28
作者:  Yu, DQ;  Duan, LL;  Zhao, J;  Lai, W
收藏  |  浏览/下载：1/0  |  提交时间：2020/01/02

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