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Wetting behavior and interfacial characteristic of the Sn-3.5Ag alloy on Ni substrates 会议论文
Zang, Li Kun; Yan, Hong Liang; Yuan, Zhang Fu; Lu, Li Ying
收藏  |  浏览/下载:3/0  |  提交时间:2015/11/17
Wettability and interfacial characteristic of Sn-Ag-Cu solder on Ni substrates at elevated temperatures 会议论文
Zanga, Likun; Yuan, Zhangfu; Yan, Hongliang; Li, Xinxue
收藏  |  浏览/下载:2/0  |  提交时间:2015/11/17
A new method for visualizing 3-D vortices structures using sectional data 会议论文
Zhu, CM; Xin, DD; Zhuang, FG; Huang, YN
收藏  |  浏览/下载:2/0  |  提交时间:2015/11/13


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