CORC

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Influences of Ag and In Alloying on Microstructure and Mechanical Properties of Sn-58Bi Solder 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2020
作者:  Yang, Jie;  Zhang, Qingke;  Song, Zhenlun
收藏  |  浏览/下载:3/0  |  提交时间:2020/12/16
TENSILE  JOINTS  SILVER  CU  
Transient Soldering Reaction Mechanisms of SnCu Solder on CuNi Nano Conducting Layer and Fracture Behavior of the Joint Interfaces 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2020, 卷号: 49, 期号: 5, 页码: 3383-3390
作者:  Zhang, Qingke;  Hu, Fangqin;  Song, Zhenlun
收藏  |  浏览/下载:114/0  |  提交时间:2020/12/16
The effects of phenolic resin-derived PyC interlayers on microstructure and mechanical properties of Cf/SiC composites 期刊论文
CERAMICS INTERNATIONAL, 2018, 卷号: 44, 期号: 14, 页码: 16157-16163
作者:  Wang, Jie;  Pei, Xueliang;  Zhi, Jianhai;  Huang, Jing;  Mo, Gaoming
收藏  |  浏览/下载:262/0  |  提交时间:2018/12/04
Influences of Ag addition to Sn-58Bi solder on SnBi/Cu interfacial reaction 期刊论文
MATERIALS LETTERS, 2018, 卷号: 214, 页码: 142-145
作者:  Jiang, J. J.;  Hu, F. Q.;  Zhang, Q. K.;  Song, Z. L.
收藏  |  浏览/下载:20/0  |  提交时间:2018/12/04
The effects of phenolic resin-derived PyC interlayers on microstructure and mechanical properties of Cf/SiC composites 期刊论文
CERAMICS INTERNATIONAL, 2018, 卷号: 44, 期号: 14, 页码: 16157-16163
作者:  Wang, Jie;  Pei, Xueliang;  Zhi, Jianhai;  Huang, Jing;  Mo, Gaoming
收藏  |  浏览/下载:39/0  |  提交时间:2018/12/04
Stable planar single-layer hexagonal silicene under tensile strain and its anomalous Poisson 期刊论文
Applied Physics Letter, 2014, 卷号: 104, 期号: 8, 页码: 81902
作者:  Wang BL(王宝林);  Wu JT(吴江涛);  Gu XK;  Yin HQ;  Wei YJ(魏宇杰)
收藏  |  浏览/下载:250/0  |  提交时间:2014/05/09
How does spallation microdamage nucleate in bulk amorphous alloys under shock loading? 期刊论文
Journal of Applied Physics, 2011, 卷号: 110, 期号: 10, 页码: 103519
作者:  Huang X(黄鑫);  Ling Z(凌中);  Zhang HS(张虎生);  Ma J;  Dai LH(戴兰宏)
收藏  |  浏览/下载:183/0  |  提交时间:2012/04/01


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