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科研机构
金属研究所 [4]
沈阳应用生态研究所 [1]
上海硅酸盐研究所 [1]
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期刊论文 [6]
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2018 [3]
2017 [2]
2008 [1]
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Chemistry,... [6]
Materials ... [6]
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The interfacial reaction between In-48Sn solder and polycrystalline Cu substrate during solid state aging
期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 740, 页码: 500-509
作者:
Tian, FF
;
Li, CF
;
Zhou, M
;
Liu, ZQ
;
Liu, ZQ (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.
收藏
  |  
浏览/下载:20/0
  |  
提交时间:2018/06/05
Heterogeneous Binary-systems
Chemical-compound Layers
2 Elementary Substances
Eutectic Snin Solder
Intermetallic Compounds
Phase Identification
Reaction-diffusion
Growth-kinetics
Joint
Transformations
The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage
期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 739, 页码: 632-642
作者:
Gao, LY
;
Li, CF
;
Wan, P
;
Zhang, H
;
Liu, ZQ
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  |  
浏览/下载:24/0
  |  
提交时间:2018/06/05
Lead-free Solders
Interfacial Reactions
Sn-ag
Intermetallic Compounds
Rich Solders
Joints
Growth
Reliability
Substrate
Strength
An ion-conductive Li1.5Al0.5Ge1.5(PO4)(3)-based composite protective layer for lithium metal anode in lithium-sulfur batteries
期刊论文
JOURNAL OF POWER SOURCES, 2018, 卷号: 377, 页码: 36, 43
作者:
Sun, Changzhi
;
Huang, Xiao
;
Jin, Jun
;
Lu, Yang
;
Wang, Qing
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  |  
浏览/下载:33/0
  |  
提交时间:2018/12/28
Ion-conductive
LAGP
Li metal anode
Composite protective layer
Li-S battery
Electromigration anisotropy introduced by tin orientation in solder joints
期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2017, 卷号: 703, 页码: 264-271
Chen, Jian-Qiang
;
Liu, Kai-Lang
;
Guo, Jing-Dong
;
Ma, Hui-Cai
;
Wei, Song
;
Shang, Jian-Ku
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  |  
浏览/下载:23/0
  |  
提交时间:2017/08/17
Electromigration
Single crystal tin
Cu6Sn5
Intermetallic compounds
Orientation
Diffusion
The relation between wetting and interfacial chemistry in the Zr-Based BMGs/W system
期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2017, 卷号: 690, 页码: 903-908
Ma, G. F.
;
Ye, H.
;
Zhang, H. L.
;
He, C. L.
;
Sun, L. N.
;
Zhang, H. F.
;
Hu, Z. Q.
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浏览/下载:57/0
  |  
提交时间:2017/08/17
Wetting
Interface
W
Zr-based BMG
Nb
Wetting behavior and interfacial characteristics of In-Sn alloy on CuZr-based bulk metallic glass
期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2008, 卷号: 464, 期号: 1-2, 页码: 248-251
作者:
Ma, GF
;
Zhang, HL
;
Zhang, HF
;
Li, H
;
Hu, ZQ
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浏览/下载:11/0
  |  
提交时间:2011/09/23
Wettability
Interface
Diffusion
Reaction
Bmg
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