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Research on Bi contents addition into Sn-Cu-based lead-free solder alloy 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2022, 卷号: 33, 期号: 19, 页码: 15586-15603
作者:  Huang, Hai;  Chen, Bin;  Hu, Xiaowu;  Jiang, Xiongxin;  Li, Qinglin
收藏  |  浏览/下载:88/0  |  提交时间:2022/07/19
Effects of remelting temperature on the microstructure evolution of Ni60/WC directional structure coating 期刊论文
Harbin Gongcheng Daxue Xuebao/Journal of Harbin Engineering University, 2022, 卷号: 43, 期号: 4, 页码: 587-592
作者:  Yang, Xiaotian;  Wei, Hengli;  Zhou, Jun;  Wang, Xinhua;  Zeng, Rong
收藏  |  浏览/下载:17/0  |  提交时间:2022/06/20
Microstructure and mechanical properties of extruded and aged Mg-Y-Cu alloy 期刊论文
Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals, 2022, 卷号: 32, 期号: 3, 页码: 731-740
作者:  Bi, Guang-Li;  Zhang, Niu-Ming;  Jiang, Jing;  Chen, Ti-Jun;  Jiang, Chun-Hong
收藏  |  浏览/下载:19/0  |  提交时间:2022/06/20
Effects of rolling reduction on microstructural evolution and mechanical properties of W-0.5wt%ZrC alloys 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2022, 卷号: 830
作者:  Zhao, B. L.;  Xia, Y. P.;  Zhang, L. F.;  Ke, J. G.;  Cheng, X.
收藏  |  浏览/下载:59/0  |  提交时间:2022/01/10


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