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科研机构
兰州理工大学 [9]
金属研究所 [7]
合肥物质科学研究院 [4]
宁波材料技术与工程研... [2]
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期刊论文 [24]
学位论文 [1]
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2020 [25]
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Materials ... [1]
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Constrained minimal-interface structures in polycrystalline copper with extremely fine grains
期刊论文
SCIENCE, 2020, 卷号: 370, 期号: 6518, 页码: 831-+
作者:
Li, X. Y.
;
Jin, Z. H.
;
Zhou, X.
;
Lu, K.
收藏
  |  
浏览/下载:24/0
  |  
提交时间:2021/02/03
Efficient TiO2/AgInS2/ZnS Nanoarchitecture Photoelectrode for the Photoelectrochemical Cathodic Protection of Copper in NaCl Solution
期刊论文
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2020, 卷号: 167, 期号: 14, 页码: 10
作者:
Lu, Guiying
;
Sun, Mengmeng
;
Chen, Zhuoyuan
;
Jiang, Xuhong
;
Jing, Jiangping
收藏
  |  
浏览/下载:28/0
  |  
提交时间:2021/04/12
TiO2
AgInS2
ZnS nanoheterojunction
photoelectrochemical cathodic protection
pure copper
NaCl solution
Effect of post-weld annealing on microstructure and growth behavior of copper/aluminum friction stir welded joint
期刊论文
Materials, 2020, 卷号: 13, 期号: 20, 页码: 1-17
作者:
Jin, Yuhua
;
Wu, Bo
;
Lu, Xuetian
;
Xing, Yichu
;
Zhou, Zizheng
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2020/11/14
Aluminum
Aluminum alloys
Annealing
Binary alloys
Copper
Copper alloys
Friction
Intermetallics
Microstructure
Research laboratories
Welds
Annealing temperatures
Friction stir welded joints
Growth mechanisms
Interface mi-crostructure
Layered Structures
Original structures
Post-weld annealing
Softening phenomenon
Biodegradable ternary Zn-3Ge-0.5X (X=Cu, Mg, and Fe) alloys for orthopedic applications
期刊论文
ACTA BIOMATERIALIA, 2020, 卷号: 115
作者:
Lin, Jixing
;
Tong, Xian
;
Sun, Quanxiang
;
Luan, Yanan
;
Zhang, Dechuang
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  |  
浏览/下载:58/0
  |  
提交时间:2020/11/30
Cytotoxicity
Degradation behavior
Mechanical properties
Zn-Ge biodegradable metals
低温化学气相沉积金属钛膜及其抗腐蚀研究
学位论文
: 中国科学院大学, 2020
作者:
郭俊杰
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  |  
浏览/下载:18/0
  |  
提交时间:2021/09/07
金属钛膜, 抗腐蚀,化学气相沉积, 钛前驱体, 二氯化钛
Effect of Different Filler Wires on Mechanical Property and Conductivity of Aluminum-Copper Joints
期刊论文
MATERIALS, 2020, 卷号: 13, 期号: 16
作者:
Zhang, Hengming
;
Shi, Yu
;
Gu, Yufen
;
Li, Chunkai
收藏
  |  
浏览/下载:17/0
  |  
提交时间:2022/03/01
different filler wires
alloy elements
microhardness
conductivity
tensile strength
Effect of fifferent filler wires on mechanical property and conductivity of aluminum-copper joints
期刊论文
Materials, 2020, 卷号: 13, 期号: 16
作者:
Zhang, Hengming
;
Shi, Yu
;
Gu, Yufen
;
Li, Chunkai
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  |  
浏览/下载:3/0
  |  
提交时间:2020/11/14
Aluminum
Binary alloys
Brazing
Copper
Fillers
Gas metal arc welding
Gas welding
Intermetallics
Microhardness
Silicon
Tensile strength
Wire
Aluminum silicons
Aluminum-copper
Aluminum-magnesium
Brazing interface
Double electrodes
Element contents
Intermetallic compound layer
Pure aluminum
Rough surface of copper-bearing titanium alloy with multifunctions of osteogenic ability and antibacterial activity
期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2020, 卷号: 48, 页码: 130-139
作者:
Liu, Hui
;
Liu, Rui
;
Ullah, Ihsan
;
Zhang, Shuyuan
;
Sun, Ziqing
收藏
  |  
浏览/下载:20/0
  |  
提交时间:2021/02/02
Titanium
Copper
Roughness surface
Osteogenesis
Antibacterial
Rough surface of copper-bearing titanium alloy with multifunctions of osteogenic ability and antibacterial activity
期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2020, 卷号: 48, 页码: 130-139
作者:
Liu, Hui
;
Liu, Rui
;
Ullah, Ihsan
;
Zhang, Shuyuan
;
Sun, Ziqing
收藏
  |  
浏览/下载:23/0
  |  
提交时间:2021/02/02
Titanium
Copper
Roughness surface
Osteogenesis
Antibacterial
Comparison study of gold coatings prepared by traditional and modified galvanic replacement deposition for corrosion prevention of copper
期刊论文
Microelectronics Reliability, 2020, 卷号: 110
作者:
Zhang, Xingkai
;
Qian, Qingyi
;
Qiang, Li
;
Zhang, Bin
;
Zhang, Junyan
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2020/11/14
Aluminum coatings
Binary alloys
Copper alloys
Copper corrosion
Copper metallography
Corrosion prevention
Corrosion resistance
Corrosion resistant coatings
Deposition
Galvanic corrosion
Gold alloys
Gold metallography
Sodium chloride
Substrates
X ray diffraction
X ray photoelectron spectroscopy
3.5 wt% NaCl solution
Comparison study
Copper substrates
Corrosion current densities
Corrosion inhibition efficiency
Galvanic couples
Galvanic replacements
Solid solution phase
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