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科研机构
兰州理工大学 [18]
金属研究所 [10]
合肥物质科学研究院 [2]
力学研究所 [1]
过程工程研究所 [1]
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期刊论文 [31]
学位论文 [1]
发表日期
2020 [32]
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Effects of SnO2 Nanoparticles on Microstructure and Intermetallic Compounds of Sn0.6Cu Solder
期刊论文
Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2020, 卷号: 49, 期号: 12, 页码: 4297-4302
作者:
Yu, Weiyuan
;
Sun, Jungang
;
Liu, Yun
;
B., Wu
;
Z., Lei
收藏
  |  
浏览/下载:8/0
  |  
提交时间:2022/02/17
Binary alloys
Brazing
Brazing filler metals
Grain size and shape
Intermetallics
Melting point
Microstructure
Nanoparticles
Synthesis (chemical)
Brazing joints
Composite solders
Crystal planes
Driving forces
Interfacial intermetallics
Liquidus temperature
Melting process
Melting properties
Kinetics of Ultrasonic and Current Coupling-Enhanced Dissolution of Copper in Liquid Tin
期刊论文
Journal of Electronic Materials, 2020, 卷号: 49, 期号: 11, 页码: 6590-6597
作者:
Sun, Xuemin
;
Yu, Weiyuan
;
Wang, Yanhong
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2022/02/17
Activation energy
Copper
Liquids
Microelectronics
Soldering
Thermal gradients
Tin
Ultrasonics
Copper dissolution
Development trends
Dissolution kinetics
Dissolution rates
Enhanced dissolutions
Microelectronic products
Multifunctionality
Sound pressure distribution
Kinetics of Ultrasonic and Current Coupling-Enhanced Dissolution of Copper in Liquid Tin
期刊论文
Journal of Electronic Materials, 2020, 卷号: 49, 期号: 11, 页码: 6590-6597
作者:
Sun, Xuemin
;
Yu, Weiyuan
;
Wang, Yanhong
收藏
  |  
浏览/下载:8/0
  |  
提交时间:2020/11/14
Activation energy
Copper
Liquids
Microelectronics
Soldering
Thermal gradients
Tin
Ultrasonics
Copper dissolution
Development trends
Dissolution kinetics
Dissolution rates
Enhanced dissolutions
Microelectronic products
Multifunctionality
Sound pressure distribution
Shuffle and glide mechanisms of prismatic dislocations in a hexagonal C14-type Laves-phase intermetallic compound
期刊论文
PHYSICAL REVIEW B, 2020, 卷号: 102, 期号: 13, 页码: 9
作者:
Zhang, Yongchao
;
Zhang, Wei
;
Du, Beining
;
Li, Wenqing
;
Sheng, Liyuan
收藏
  |  
浏览/下载:13/0
  |  
提交时间:2021/02/02
Shuffle and glide mechanisms of prismatic dislocations in a hexagonal C14-type Laves-phase intermetallic compound
期刊论文
PHYSICAL REVIEW B, 2020, 卷号: 102, 期号: 13, 页码: 9
作者:
Zhang, Yongchao
;
Zhang, Wei
;
Du, Beining
;
Li, Wenqing
;
Sheng, Liyuan
收藏
  |  
浏览/下载:24/0
  |  
提交时间:2021/02/02
Effect of post-weld annealing on microstructure and growth behavior of copper/aluminum friction stir welded joint
期刊论文
Materials, 2020, 卷号: 13, 期号: 20, 页码: 1-17
作者:
Jin, Yuhua
;
Wu, Bo
;
Lu, Xuetian
;
Xing, Yichu
;
Zhou, Zizheng
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2020/11/14
Aluminum
Aluminum alloys
Annealing
Binary alloys
Copper
Copper alloys
Friction
Intermetallics
Microstructure
Research laboratories
Welds
Annealing temperatures
Friction stir welded joints
Growth mechanisms
Interface mi-crostructure
Layered Structures
Original structures
Post-weld annealing
Softening phenomenon
High performance and low thermal expansion in Er-Fe-V-Mo dual-phase alloys
期刊论文
ACTA MATERIALIA, 2020, 卷号: 198, 页码: 271-280
作者:
Lin, Kun
;
Li, Wenjie
;
Yu, Chengyi
;
Jiang, Suihe
;
Cao, Yili
收藏
  |  
浏览/下载:25/0
  |  
提交时间:2021/02/02
Low thermal expansion
Magnetovolume effect
Crystal structure
Neutron diffraction
Mechanical properties
Intermetallic compound
High performance and low thermal expansion in Er-Fe-V-Mo dual-phase alloys
期刊论文
ACTA MATERIALIA, 2020, 卷号: 198, 页码: 271-280
作者:
Lin, Kun
;
Li, Wenjie
;
Yu, Chengyi
;
Jiang, Suihe
;
Cao, Yili
收藏
  |  
浏览/下载:18/0
  |  
提交时间:2021/02/02
Low thermal expansion
Magnetovolume effect
Crystal structure
Neutron diffraction
Mechanical properties
Intermetallic compound
The interfacial reaction and microstructure of Co/In/Cu sputtering target assembly after soldering
期刊论文
MICROELECTRONICS RELIABILITY, 2020, 卷号: 113, 页码: 6
作者:
Liu, Zhi-Quan
;
Meng, Zhi-Chao
;
Wu, Di
;
Shang, Zhengang
;
He, Xin
收藏
  |  
浏览/下载:70/0
  |  
提交时间:2021/02/02
Co sputtering target
Soldering assembly
Interface
IMC
Growth mechanism
The effect of finish layer on the interfacial cracking failure of Au-Si bonding
期刊论文
ENGINEERING FAILURE ANALYSIS, 2020, 卷号: 115, 页码: 8
作者:
Gao, Li-Yin
;
Wen, Jian
;
Li, Cai-Fu
;
Chen, Chunhuan
;
Liu, Zhi-Quan
收藏
  |  
浏览/下载:15/0
  |  
提交时间:2021/02/02
AuSi bonding
NiCo
Intermetallic compounds (IMCs)
Failure analysis
Crack
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