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科研机构
兰州理工大学 [18]
内容类型
期刊论文 [18]
发表日期
2020 [18]
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共18条,第1-10条
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发表日期:2020
专题:兰州理工大学
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Effects of SnO2 Nanoparticles on Microstructure and Intermetallic Compounds of Sn0.6Cu Solder
期刊论文
Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2020, 卷号: 49, 期号: 12, 页码: 4297-4302
作者:
Yu, Weiyuan
;
Sun, Jungang
;
Liu, Yun
;
B., Wu
;
Z., Lei
收藏
  |  
浏览/下载:8/0
  |  
提交时间:2022/02/17
Binary alloys
Brazing
Brazing filler metals
Grain size and shape
Intermetallics
Melting point
Microstructure
Nanoparticles
Synthesis (chemical)
Brazing joints
Composite solders
Crystal planes
Driving forces
Interfacial intermetallics
Liquidus temperature
Melting process
Melting properties
Kinetics of Ultrasonic and Current Coupling-Enhanced Dissolution of Copper in Liquid Tin
期刊论文
Journal of Electronic Materials, 2020, 卷号: 49, 期号: 11, 页码: 6590-6597
作者:
Sun, Xuemin
;
Yu, Weiyuan
;
Wang, Yanhong
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2022/02/17
Activation energy
Copper
Liquids
Microelectronics
Soldering
Thermal gradients
Tin
Ultrasonics
Copper dissolution
Development trends
Dissolution kinetics
Dissolution rates
Enhanced dissolutions
Microelectronic products
Multifunctionality
Sound pressure distribution
Kinetics of Ultrasonic and Current Coupling-Enhanced Dissolution of Copper in Liquid Tin
期刊论文
Journal of Electronic Materials, 2020, 卷号: 49, 期号: 11, 页码: 6590-6597
作者:
Sun, Xuemin
;
Yu, Weiyuan
;
Wang, Yanhong
收藏
  |  
浏览/下载:8/0
  |  
提交时间:2020/11/14
Activation energy
Copper
Liquids
Microelectronics
Soldering
Thermal gradients
Tin
Ultrasonics
Copper dissolution
Development trends
Dissolution kinetics
Dissolution rates
Enhanced dissolutions
Microelectronic products
Multifunctionality
Sound pressure distribution
Effect of post-weld annealing on microstructure and growth behavior of copper/aluminum friction stir welded joint
期刊论文
Materials, 2020, 卷号: 13, 期号: 20, 页码: 1-17
作者:
Jin, Yuhua
;
Wu, Bo
;
Lu, Xuetian
;
Xing, Yichu
;
Zhou, Zizheng
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2020/11/14
Aluminum
Aluminum alloys
Annealing
Binary alloys
Copper
Copper alloys
Friction
Intermetallics
Microstructure
Research laboratories
Welds
Annealing temperatures
Friction stir welded joints
Growth mechanisms
Interface mi-crostructure
Layered Structures
Original structures
Post-weld annealing
Softening phenomenon
Influences of different barrier films on microstructures and electrical properties of Bi2Te3-based joints
期刊论文
Journal of Materials Science: Materials in Electronics, 2020, 卷号: 31, 期号: 17, 页码: 14714-14729
作者:
Cheng, Jinxuan
;
Hu, Xiaowu
;
Li, Qinglin
收藏
  |  
浏览/下载:17/0
  |  
提交时间:2020/11/14
Bismuth compounds
Diffusion barriers
Gold
Gold compounds
Heat resistance
Microstructure
Nickel
Open circuit voltage
Soldering
Barrier films
Diffusion barrier films
Electrical resistances
Output current
Reflow--soldering
Solder joints
Temperature differences
Thermoelectric
Effect of Power Ultrasound on Dissolution Behavior of Cu/Sn System
期刊论文
Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2020, 卷号: 49, 期号: 8, 页码: 2724-2729
作者:
Yu, Weiyuan
;
Lei, Zhen
;
Sun, Xuemin
;
Wu, Baolei
;
Sun, Jungang
收藏
  |  
浏览/下载:6/0
  |  
提交时间:2020/11/14
Acoustic streaming
Atoms
Cavitation
Copper
Dissolution
Liquids
Solubility
Tin
Ultrasonics
Cavitation bubble
Dissolution behavior
Dissolution rates
Method of finite elements
Saturated solubility
Solid solubilities
Solid-liquid interfaces
Ultrasonic cavitation
Effect of Power Ultrasound on Dissolution Behavior of Cu/Sn System
期刊论文
Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2020, 卷号: 49, 期号: 8, 页码: 2724-2729
作者:
Yu, Weiyuan
;
Lei, Zhen
;
Sun, Xuemin
;
Wu, Baolei
;
Sun, Jungang
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2022/02/17
Acoustic streaming
Atoms
Cavitation
Copper
Dissolution
Liquids
Solubility
Tin
Ultrasonics
Cavitation bubble
Dissolution behavior
Dissolution rates
Method of finite elements
Saturated solubility
Solid solubilities
Solid-liquid interfaces
Ultrasonic cavitation
Effect of Different Filler Wires on Mechanical Property and Conductivity of Aluminum-Copper Joints
期刊论文
MATERIALS, 2020, 卷号: 13, 期号: 16
作者:
Zhang, Hengming
;
Shi, Yu
;
Gu, Yufen
;
Li, Chunkai
收藏
  |  
浏览/下载:19/0
  |  
提交时间:2022/03/01
different filler wires
alloy elements
microhardness
conductivity
tensile strength
Effect of fifferent filler wires on mechanical property and conductivity of aluminum-copper joints
期刊论文
Materials, 2020, 卷号: 13, 期号: 16
作者:
Zhang, Hengming
;
Shi, Yu
;
Gu, Yufen
;
Li, Chunkai
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2020/11/14
Aluminum
Binary alloys
Brazing
Copper
Fillers
Gas metal arc welding
Gas welding
Intermetallics
Microhardness
Silicon
Tensile strength
Wire
Aluminum silicons
Aluminum-copper
Aluminum-magnesium
Brazing interface
Double electrodes
Element contents
Intermetallic compound layer
Pure aluminum
Effect of Co addition into Ni film on shear strength of solder/Ni/Cu system: Experimental and theoretical investigations
期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2020, 卷号: 788
作者:
Bi, Xiaoyang
;
Hu, Xiaowu
;
Li, Qinglin
收藏
  |  
浏览/下载:16/0
  |  
提交时间:2022/03/01
Solder joints
Ni-Co film
Shear strength
Atomic model
Intermetallic compound
First-principles calculations
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