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浏览/检索结果: 共9条，第1-9条 帮助 限定条件 发表日期：2019     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder 期刊论文 ACTA METALLURGICA SINICA, 2019, 卷号: 55, 期号: 12, 页码: 1606-1614 作者:  Cao Lihua;  Chen Yinbo;  Shi Qiyuan;  Yuan Jie;  Liu Zhiquan 收藏  |  浏览/下载：129/0  |  提交时间：2021/02/02 alloy element  Sn-Ag-Cu solder  intermetallic compound  interfacial morphology  shear strength   Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 16, 页码: 15054-15063 作者:  Zhao, Meng;  Zhang, Liang;  Liu, Zhi-quan;  Xiong, Ming-yue;  Sun, Lei 收藏  |  浏览/下载：19/0  |  提交时间：2021/02/02 Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 16, 页码: 15054-15063 作者:  Zhao, Meng;  Zhang, Liang;  Liu, Zhi-quan;  Xiong, Ming-yue;  Sun, Lei 收藏  |  浏览/下载：24/0  |  提交时间：2021/02/02 Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文 MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18 作者:  Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua 收藏  |  浏览/下载：26/0  |  提交时间：2021/02/02 62Sn36Pb2Ag solder joint  Microstructural evolution  Failure analysis  Intermetallic compound (IMC)  Thermal cycling   Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文 MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18 作者:  Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua 收藏  |  浏览/下载：43/0  |  提交时间：2021/02/02 62Sn36Pb2Ag solder joint  Microstructural evolution  Failure analysis  Intermetallic compound (IMC)  Thermal cycling   Reactive wetting of amorphous silica by Sn0.3Ag0.7Cu-xTi (x = 1 and 3wt.%)alloys at 800–900°C 期刊论文 Ceramics International, 2019, 卷号: 45, 期号: 10, 页码: 12920-12925 作者:  Sui, Ran;  Wang, Jianbin;  Ci, Wenjuan;  Lin, Qiaoli;  Yang, Hongyu 收藏  |  浏览/下载：26/0  |  提交时间：2020/11/14 Dissolution  Interfaces (materials)  Joining  Oxides  Reaction products  Silica  Silicon  Wetting  Adsorption at interfaces  Amorphous silica  High melting point  Liquid/solid interface  Modified sessile drop method  Product control  Reactive wetting  Spreading dynamics   Wetting of amorphous and partial crystalline Co73Si10B17 by Sn and Sn-based lead-free solders 期刊论文 MICROELECTRONICS RELIABILITY, 2019, 卷号: 98, 页码: 112-118 作者:  Lin, Qiaoli;  Ye, Changsheng;  Sui, Ran;  Ci, Wenjuan 收藏  |  浏览/下载：14/0  |  提交时间：2019/11/15 Wettability  Oxide film  Intermetallics  Joining   Reactive wetting of amorphous silica by Sn0.3Ag0.7Cu-xTi (x=1 and 3 wt.%) alloys at 800-900 degrees C 期刊论文 CERAMICS INTERNATIONAL, 2019, 卷号: 45, 期号: 10, 页码: 12920-12925 作者:  Sui, Ran;  Wang, Jianbin;  Ci, Wenjuan;  Lin, Qiaoli;  Yang, Hongyu 收藏  |  浏览/下载：6/0  |  提交时间：2019/11/15 Wettability  Oxides  Interface  Joining   Enhancement of the mechanical strength of Sn-3.0Ag-0.5Cu/Ni joints via doping minor Ni into solder alloy. 期刊论文 Materials Letters, 2019, 卷号: Vol.235, 页码: 180-183 作者:  Chou, Tzu-Ting;  Song, Rui-Wen;  Chen, Wei-Yu;  Duh, Jenq-Gong 收藏  |  浏览/下载：14/0  |  提交时间：2019/12/17 MICROSTRUCTURE  *MECHANICAL  strength  of  condensed  matter  *PRECIPITATION  (Chemistry)  *SEPARATION  (Technology)  *SOLDER  &  soldering