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金属研究所 [7]
兰州理工大学 [4]
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期刊论文 [21]
发表日期
2019 [21]
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A new method for locating Kikuchi bands in electron backscatter diffraction patterns
期刊论文
MICROSCOPY RESEARCH AND TECHNIQUE, 2019, 卷号: 82, 期号: 12, 页码: 2035
作者:
Zhang, Yongsheng
;
Fang, Shangqiang
;
Lin, Chucheng
;
Zhang, Jimei
;
Jiang, Caifen
收藏
  |  
浏览/下载:135/0
  |  
提交时间:2019/12/31
edge detection
electron backscatter diffraction
image processing
Kikuchi bands
Characterization of lattice defects and tensile deformation of biomedical Co29Cr9W3Cu alloy produced by selective laser melting
期刊论文
ADDITIVE MANUFACTURING, 2019, 卷号: 30, 页码: 13
作者:
Lu, Yanjin
;
Yang, Chunguang
;
Liu, Yujing
;
Yang, Ke
;
Lin, Jinxin
收藏
  |  
浏览/下载:130/0
  |  
提交时间:2021/02/02
Co29Cr9W3Cu alloy
Selective laser melting
Lattice defects
Tensile deformation
Martensitic transformation
The effects of Ni addition on microstructure evolution and mechanical properties of solder joints undergoing solid-liquid electromigration
期刊论文
MATERIALS LETTERS, 2019, 卷号: 256
作者:
Qiu, Hongyu
;
Hu, Xiaowu
;
Jiang, Xiongxin
;
Li, Qinglin
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  |  
浏览/下载:18/0
  |  
提交时间:2019/11/15
Grain orientation
Electromigration
Intermetallic compounds
Diffusion
Microstructure Evolution and Dynamic Recrystallization Mechanism of GH4169 Alloy During Cross Wedge Rolling
期刊论文
RARE METAL MATERIALS AND ENGINEERING, 2019, 卷号: 48, 期号: 11, 页码: 3556-3562
作者:
Gan Hongyan
;
Cheng Ming
;
Song Hongwu
;
Chen Yan
;
Zhang Shihong
收藏
  |  
浏览/下载:9/0
  |  
提交时间:2021/02/02
GH4169 alloy
cross wedge rolling
microstructure
dynamic recrystallization
Microstructure Evolution and Dynamic Recrystallization Mechanism of GH4169 Alloy During Cross Wedge Rolling
期刊论文
RARE METAL MATERIALS AND ENGINEERING, 2019, 卷号: 48, 期号: 11, 页码: 3556-3562
作者:
Gan Hongyan
;
Cheng Ming
;
Song Hongwu
;
Chen Yan
;
Zhang Shihong
收藏
  |  
浏览/下载:9/0
  |  
提交时间:2021/02/02
GH4169 alloy
cross wedge rolling
microstructure
dynamic recrystallization
Peak selection matters in principal component analysis: A case study of syntrophic microbes
期刊论文
BIOINTERPHASES, 2019, 卷号: 14, 期号: 5, 页码: 51004
作者:
Yang, CY
;
Wei, WC
;
Liu, FH
;
Yu, XY
收藏
  |  
浏览/下载:25/0
  |  
提交时间:2020/07/08
ION MASS-SPECTROMETRY
INTERSPECIES ELECTRON-TRANSFER
GEOBACTER-SULFURREDUCENS
SP-NOV
TIME
REDUCTION
BIOFILMS
SIMS
SURFACES
ADHESION
The effect of three-dimensional loading and texture on deformation mechanism of Zircaloy-4 alloy: Using space Schmid factor model
期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 761, 页码: 11
作者:
Zhang, Yingdong
;
Li, Geping
;
Liu, Chengze
;
Yuan, Fusen
;
Han, Fuzhou
收藏
  |  
浏览/下载:19/0
  |  
提交时间:2021/02/02
Zircaloy-4 alloy
Three-dimensional loading
Space Schmid factor model
Deformation mechanism
The effect of three-dimensional loading and texture on deformation mechanism of Zircaloy-4 alloy: Using space Schmid factor model
期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 761, 页码: 11
作者:
Zhang, Yingdong
;
Li, Geping
;
Liu, Chengze
;
Yuan, Fusen
;
Han, Fuzhou
收藏
  |  
浏览/下载:33/0
  |  
提交时间:2021/02/02
Zircaloy-4 alloy
Three-dimensional loading
Space Schmid factor model
Deformation mechanism
Study on copper protrusion of through-silicon via in a 3-D integrated circuit
期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 755, 页码: 66-74
作者:
Song M
;
Wei ZQ
;
Wang BY
;
Chen L
;
Chen L
收藏
  |  
浏览/下载:55/0
  |  
提交时间:2019/11/27
Through-silicon via
Cu protrusion
Annealing temperature
Electron backscatter diffraction
Finite element analysis
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