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科研机构
北京航空航天大学 [21]
内容类型
期刊论文 [14]
会议论文 [7]
发表日期
2019 [21]
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发表日期:2019
专题:北京航空航天大学
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Field-to-Wire Coupling Model for Wire Bundles with Strongly Non-uniform Path
会议论文
2018 International Applied Computational Electromagnetics Society Symposium in China, ACES-China 2018, 2018-07-29
作者:
Song, X.
;
Su, D.
;
Wang, J.
;
Li, B.
收藏
  |  
浏览/下载:13/0
  |  
提交时间:2019/12/30
Computational electromagnetics
Equivalent circuits
Linear transformations
Linearization
External characteristic
Field to wires
Internal characteristics
Mode conversions
Mode transformation
Multi-conductor transmission lines
Non-uniform
Transformation matrices
Wire
Layered composite entangled wire materials blocks as pre-tensioned vertebral rocking columns
期刊论文
COMPOSITE STRUCTURES, 2019, 卷号: 214, 页码: 153-163
作者:
Kashani, Mohammad M.
;
Ahmadi, Ehsan
;
Gonzalez-Buelga, Alicia
;
Zhang, Dayi
;
Scarpa, Fabrizio
收藏
  |  
浏览/下载:8/0
  |  
提交时间:2019/12/30
Rocking column
Entangled wire material (EWM) layers
Vertebral bridge pier
Accelerated bridge construction
Swing Touch Risk Assessment of Bonding Wires in High-Density Package Under Mechanical Shock Condition
期刊论文
JOURNAL OF ELECTRONIC PACKAGING, 2019, 卷号: 141
作者:
Fu, Guicui
;
Jiang, Maogong
;
Wan, Bo
;
Li, Yanruoyue
;
Ma, Cheng
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/12/30
bonding wire
touch risk assessment
high-density package
mechanical shock
Microstructure and mechanical properties of wire plus arc additively manufactured 2024 aluminum alloy components: As-deposited and post heat-treated
期刊论文
JOURNAL OF MANUFACTURING PROCESSES, 2019, 卷号: 40, 页码: 27-36
作者:
Qi, Zewu
;
Qi, Bojin
;
Cong, Baoqiang
;
Sun, Hongye
;
Zhao, Gang
收藏
  |  
浏览/下载:11/0
  |  
提交时间:2019/12/30
Wire plus arc additive manufacturing
2024 Aluminum alloy
As-deposited
Heat treatment
Microstructure
Mechanical property
Performance Improvement of Microwave Vector Modulator through Coupler Characteristic Impedance Optimization and Bond-wire Inductance Utilization
期刊论文
IEEE ACCESS, 2019, 卷号: 7, 页码: 6151-6160
作者:
Chen, Chen
;
Dilshad, Umar
;
Mehdi, Ghulam
;
Wang, Chao
;
Hu, Anyong
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/12/30
Cold pHEMT
bond-wire
microwave integrated circuit (MMIC)
parasitic elements
vector modulator
A Path Planning Method for Robotic Wire and Arc Additive Manufacturing of Thin-Walled Structures with Varying Thickness
会议论文
IOP Conference Series: Materials Science and Engineering, 2018-10-12
作者:
Ma, G.
;
Zhao, G.
;
Li, Z.
;
Xiao, W.
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/12/30
3D printers
Additives
Geometry
Motion planning
Musculoskeletal system
Robot programming
Adaptive path planning
Bead width
Manufacturing components
Path planning method
Potential technologies
Research interests
Straight skeleton
Varying thickness
Thin walled structures
Experimental and numerical studies on a novel shape-memory alloy wire-woven trusses capable of undergoing large deformation
期刊论文
JOURNAL OF INTELLIGENT MATERIAL SYSTEMS AND STRUCTURES, 2019, 卷号: 30, 页码: 2283-2298
作者:
Rao, Zhixiang
;
Yan, Xiaojun
;
Zhang, Xiaoyong
;
Zhang, Bin
;
Jiang, Jun
收藏
  |  
浏览/下载:9/0
  |  
提交时间:2019/12/30
Cellular materials
wire-woven material
shape-memory alloy
superelastic
energy dissipation
Effect of Frictional Conditions on the Generation of Fine Grain Layers in Drawing of Thin Steel Wires
期刊论文
METALS, 2019, 卷号: 9
作者:
Stolyarov, Alexey
;
Polyakova, Marina
;
Atangulova, Guzel
;
Alexandrov, Sergei
;
Lang, Lihui
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/12/30
friction
drawing
thin wire
fine grain layer
Investigation on the normal acoustic impedance of a wire screen bounded to a slit resonator
会议论文
26th International Congress on Sound and Vibration, ICSV 2019, Montreal, QC, Canada, 2019-07-07
作者:
Chen, Chao
;
Li, Xiaodong
;
Xu, Jun
收藏
  |  
浏览/下载:6/0
  |  
提交时间:2019/12/30
High temperature performance of coaxial h-BN/CNT wires above 1,000 degrees C: Thermionic electron emission and thermally activated conductivity
期刊论文
NANO RESEARCH, 2019, 卷号: 12, 页码: 1855-1861
作者:
Yang, Xinhe
;
Liu, Peng
;
Zhou, Duanliang
;
Gao, Feng
;
Wang, Xinhe
收藏
  |  
浏览/下载:15/0
  |  
提交时间:2019/12/30
high temperature wire
carbon nanotube (CNT)
h-boron nitride (h-BN)
work function
bandgap
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