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Thermal conductivity and thermal expansion of few-layer h-BN/Cu composites 期刊论文
Materials Research Bulletin, 2019, 页码: 110606
作者:  Dongqin Wan;  Xinzhi Wu;  Wei Zhang;  Kun Peng
收藏  |  浏览/下载:12/0  |  提交时间:2019/12/13
Thermal conductivity and thermal expansion of few-layer h-BN/Cu composites 期刊论文
Materials Research Bulletin, 2019, 卷号: Vol.120, 页码: 110606
作者:  Dongqin Wan;  Xinzhi Wu;  Wei Zhang;  Kun Peng
收藏  |  浏览/下载:2/0  |  提交时间:2019/12/13


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