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CORC

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Characterizations of a Proposed 3300-V Press-Pack IGBT Module Using Nanosilver Paste for High-Voltage Applications 期刊论文
IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS, 2018, 卷号: 6, 期号: 4, 页码: 2245-2253
作者:  Feng, Jingjing;  Mei, Yunhui;  Li, Xianbin;  Lu, Guo-Quan
收藏  |  浏览/下载：63/0  |  提交时间：2018/12/03
An Improved Domain Decomposition Method for Drop Impact Reliability Analysis of 3-D ICs 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 卷号: 8, 期号: 10, 页码: 1788-1799
作者:  Zhou, Hao;  Zhu, Hengliang;  Cui, Tao;  Pan, David Z.;  Zhou, Dian
收藏  |  浏览/下载：44/0  |  提交时间：2018/11/16
Fabrication of Ni-P coating film on diamond/Al composite and its soldering reliability 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 10, 页码: 8371-8379
作者:  Shi, QY;  Liu, ZQ;  Wu, D;  Zhang, H;  Ni, DR
收藏  |  浏览/下载：30/0  |  提交时间：2018/06/05
Multi-channel optical subassembly structure and method of packaging the structure 专利
专利号: US20180100978A1, 申请日期: 2018-04-12, 公开日期: 2018-04-12
作者:  KIM, JEONG EUN;  KANG, HYUN SEO;  KIM, KEO SIK;  KIM, SUNG CHANG;  KIM, YOUNG SUN
收藏  |  浏览/下载：26/0  |  提交时间：2019/12/30
Failure behavior of flip chip solder joint under coupling condition of thermal cycling and electrical current 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 6, 页码: 5025-5033
作者:  Zhu, QS;  Gao, F;  Ma, HC;  Liu, ZQ;  Guo, JD
收藏  |  浏览/下载：20/0  |  提交时间：2018/06/05
Hemicellulose isolated from waste liquor of viscose fiber mill for preparation of polyacrylamide-hemicellulose hybrid films 期刊论文
INTERNATIONAL JOURNAL OF BIOLOGICAL MACROMOLECULES, 2018, 卷号: 108, 页码: 1255-1260
作者:  Du, Jian;  Li, Chao;  Zha, Yadong;  Wang, Haisong
收藏  |  浏览/下载：38/0  |  提交时间：2018/09/06
Improved Reliability of Planar Power Interconnect With Ceramic-Based Structure 期刊论文
IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS, 2018, 卷号: 6, 期号: 1, 页码: 175, 187
作者:  Zhang, Hui;  Li, Jianfeng;  Dai, Jingru;  Corfield, Martin;  Liu, Xuejian
收藏  |  浏览/下载：31/0  |  提交时间：2018/12/28
pH-induced phase evolution and enhanced physical properties of co-precipitated WO3-CuO powders and reduced bodies for microelectronics packaging 期刊论文
CERAMICS INTERNATIONAL, 2018
作者:  Zhang, Le;  Zhen, Fangzheng;  Wang, Zhongying;  Jiang, Zhigang;  Wei, Shuai
收藏  |  浏览/下载：28/0  |  提交时间：2019/01/31
Enhanced thermal conductivity for Ag-deposited alumina sphere/epoxy resin composites through manipulating interfacial thermal resistance. 期刊论文
COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, 2018
作者:  Ren, Linlin;  Li, Qiang;  Lu, Jibao;  Zeng, Xiaoliang;  Sun, Rong
收藏  |  浏览/下载：28/0  |  提交时间：2019/01/31
Paralleled GaN DHEMTs integrated cascode GaN switch for high-current applications 期刊论文
ELECTRONICS LETTERS, 2018, 卷号: 54, 页码: 899-900
作者:  Zhu, Tianhua;  Zhuo, Fang
收藏  |  浏览/下载：16/0  |  提交时间：2019/11/19

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