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Fabrication of Ni-P coating film on diamond/Al composite and its soldering reliability 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 10, 页码: 8371-8379
作者:  Shi, QY;  Liu, ZQ;  Wu, D;  Zhang, H;  Ni, DR
收藏  |  浏览/下载:30/0  |  提交时间:2018/06/05
Adhesive transfer at copper/diamond interface and adhesion reduction mechanism with fluorine passivation: A first-principles study 期刊论文
Carbon, 2018, 卷号: 127, 页码: 548-556
作者:  Pu JB(蒲吉斌);  Pu JB(蒲吉斌);  Liu, Zengjia;  Zheng, Shaoxian;  Lu ZB(鲁志斌)
收藏  |  浏览/下载:24/0  |  提交时间:2018/06/20
Thermal conductivity and mechanical properties of flake graphite/copper composite with a boron carbide-boron nano-layer on graphite surface 期刊论文
COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, 2018, 卷号: 106, 页码: 42-51
作者:  Lv, D. J.;  Bai, H.;  Xue, C.;  Lyu, J. L.;  Li, J.
收藏  |  浏览/下载:25/0  |  提交时间:2018/12/04
Adhesive transfer at copper/diamond interface and adhesion reduction mechanism with fluorine passivation: A first-principles study 期刊论文
CARBON, 2018, 卷号: 127, 页码: 548-556
作者:  Pu, Jibin;  Liu, Zengjia;  Zheng, Shaoxian;  Lu, Zhibin;  Zhang, Guangan
收藏  |  浏览/下载:26/0  |  提交时间:2018/12/04
Enhanced thermal conductivity in Cu/diamond composites by tailoring the thickness of interfacial TiC layer 期刊论文
COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, 2018, 卷号: 113, 页码: 76-82
作者:  Wang, Luhua[1];  Li, Jianwei[2];  Catalano, Massimo[3];  Bai, Guangzhu[4];  Li, Ning[5]
收藏  |  浏览/下载:4/0  |  提交时间:2019/12/24


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