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Reliability of 4H-SiC Junction Barrier Schottky Diodes Under High Temperature Power Cycling Stress 会议论文
作者:  Tang YD(汤益丹);  Liu XY(刘新宇);  Wang G(王刚);  Luo YF(罗亚非);  Bai Y(白云)
收藏  |  浏览/下载:16/0  |  提交时间:2019/05/14
Generation Capacity Planning with Significant Renewable Energy Penetration Considering Base-Load Cycling Capacity Constraints 会议论文
ADVANCES IN GREEN ENERGY SYSTEMS AND SMART GRID, PART III, 2018-01-01
作者:  Ma, Jingjie[1];  Zhang, Shaohua[2];  Li, Xue[3]
收藏  |  浏览/下载:5/0  |  提交时间:2019/04/22
Method to predict lifetime of IGBT under power cycling based-on fast electro-thermo-mechanical model 会议论文
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018
作者:  Jiang, M.;  Fu, G.;  Leng, H.;  Wan, B.;  Cheng, Y.
收藏  |  浏览/下载:6/0  |  提交时间:2019/12/30


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