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Highly Thermally Conductive and Light Weight Copper/Graphene Film Laminated composites for Cooling Applications 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Wang, Nan[1];  Chen, Shujing[2];  Nkansah, Amos[3];  Darmawan, Christian Chandra[4];  Ye, Lilei[5]
收藏  |  浏览/下载:13/0  |  提交时间:2019/04/22


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