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Progress in Ultrasonic Bonding Wire Process and Quality Evaluation of Bonding Point 会议论文
作者:  Zhao ZL;  Mo DF;  Wu JR;  Jiang MD;  Zhang JL
收藏  |  浏览/下载:30/0  |  提交时间:2018/11/20
To probe the performance of perovskite memory device:defects property and hysteresis 会议论文
Ziqi Xu; Nengxu Li; Guanhaojie Zheng; Qi Chen; Huanping Zhou
收藏  |  浏览/下载:4/0  |  提交时间:2017/12/03
Complete indium-free CW 200W passively cooled high power diode laser array using double-side cooling technology 会议论文
components and packaging for laser systems iii 2017, san francisco, ca, united states, 2017-01-31
作者:  Wang, Jingwei;  Zhu, Pengfei;  Liu, Hui;  Liang, Xuejie;  Wu, Dihai
收藏  |  浏览/下载:79/0  |  提交时间:2017/06/08
SiC power MOSFET with monolithically integrated Schottky barrier diode for improved switching performances 会议论文
Nuremberg, Germany, 2017-05-16
作者:  Dai, Xiaoping;  Jiang, Huaping;  Zheng, Changwei;  Ke, Maolong
收藏  |  浏览/下载:12/0  |  提交时间:2018/03/07
Embedded Measurement System of Two-dimensional Autocollimator based on FPGA 会议论文
Chongqing, PEOPLES R CHINA, 2017-10-03
作者:  Gao, Xiang;  Hu, Xiaodong;  Yang, Donglai;  Zhang, Jian;  Gao, X (reprint author), Shaanxi Normal Univ, Coll Phys & Informat Technol, Xian, Shaanxi, Peoples R China.
收藏  |  浏览/下载:19/0  |  提交时间:2018/03/06


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