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A MEMS thermal shear stress sensor produced by a combination of substrate-free structures with anodic bonding technology 期刊论文
Applied Physics Letters, 2016
作者:  Ou Y(欧毅);  Qu FR(屈芙蓉);  Wang GY(王冠亚);  Nie MY(聂孟岩);  Li ZG(李志刚)
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