QQ客服 官方微博 反馈留言

浏览/检索结果: 共8条，第1-8条 帮助 限定条件 发表日期：2016     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Self-aligned, gated bulk molybdenum field emitter arrays 其他 2016-01-01 Zhu, Ningli; Xu, Kaisi; Zhai, Yusheng; Tao, Zhi; Chen, Jing 收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03 A metal-oxide-semiconductor radiation dosimeter with a thick and defect-rich oxide layer 期刊论文 JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2016 Liu, Hongrui; Yang, Yuhao; Zhang, Jinwen 收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03 MOS dosimeter  trench-and-beam structure  MEMS-made SiO2  TSC  high sensitivity  THERMALLY-STIMULATED-CURRENT  OXIDIZED SILICON  MOS DEVICES  HOLE TRAPS  SIO2  CURRENTS  CENTERS  CAPACITORS  INSULATORS  CHARGE   Gold nanoparticle-coated silicon cone array for surface-enhanced Raman spectroscopy 期刊论文 SPECTROSCOPY LETTERS, 2016 Lai, Chun-Hong; Chen, Gang; Chen, Li; Zhang, XiaoSheng; Zhang, HaiXia; Xu, Yi 收藏  |  浏览/下载：8/0  |  提交时间：2017/12/03 Gold nanoparticle  silicon nanocone array  surfaceen-hanced Raman spectroscopy  SCATTERING  NANOGRASS  MOLECULES  FILM   SELF-ALIGNED, GATED BULK MOLYBDENUM FIELD EMITTER ARRAYS 其他 2016-01-01 Zhu, Ningli; Xu, Kaisi; Zhai, YuSheng; Tao, Zhi; Chen, Jing 收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03 EMISSION   Fabrication and Characterization of Fine Pitch TSV Integration with Self-aligned Backside Insulation Layer Opening 其他 2016-01-01 Guan, Yong; Zeng, Qinghua; Chen, Jing; Ma, Shenglin; Jin, Yufeng 收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03 TSV  3D packaging  sidewall insulation  electrical properties  CMP  THROUGH-SILICON VIAS  STACKING TECHNOLOGY  LINER   Fabrication and Filling Quality Optimization of the High Density and Small Size Through Silicon Via Array for Three-dimensional Packaging 其他 2016-01-01 Guan, Yong; Zeng, Qinghua; Chen, Jing; Ma, Shenglin; Meng, Wei; Jin, Yufeng 收藏  |  浏览/下载：2/0  |  提交时间：2017/12/03 through silicon via  packaging  electroplating  additives   Parametric Study of DRIE Process for Enhancing the Profile-preserving Property of Square Through Silicon Via 其他 2016-01-01 Guan, Yong; Zeng, Qinghua; Chen, Jing; Ma, Shenglin; Meng, Wei; Jin, Yufeng 收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03 through silicon via  3D packaging  DRJE   Fabrication and characterization of a tungsten microneedle array based on deep reactive ion etching technology 期刊论文 JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2016 Ma, Shenglin; Xia, Yanming; Wang, Yaohua; Ren, Kuili; Luo, Rongfeng; Song, Lu; Chen, Xian; Chen, Jing; Jin, Yufeng 收藏  |  浏览/下载：3/0  |  提交时间：2017/12/04 DELIVERY  ELECTRODE  HYDROGEL  DEVICES