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Effect of Remelting Duration on Microstructure and Properties of SiCp/Al Composite Fabricated by Powder-Thixoforming for Electronic Packaging 期刊论文
METALS, 2016, 卷号: 6, 期号: 12
作者:  Cai, Siyu;  Chen, Tijun;  Zhang, Xuezheng
收藏  |  浏览/下载：3/0  |  提交时间：2019/11/15
Numerical simulation of thermo-mechanical behavior in high power diode laser arrays 会议论文
17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16
作者:  Lu, Yao;  Nie, Zhiqiang;  Zhang, Pu;  Wang, Zhenfu;  Xiong, Lingling
收藏  |  浏览/下载：40/0  |  提交时间：2016/11/22
对FBGA封装的块翘曲研究 期刊论文
2016, 2016
虞国良; 谭琳; 李金睿; 王谦; YU Guoliang; TAN Lin; LI Jinrui; WANG Qian
收藏  |  浏览/下载：3/0
预加载应力对石墨IG-11热膨胀行为的影响 期刊论文
2016, 2016
易子龙; 周湘文; 于溯源; Yi Zi-long; Zhou Xiang-wen; Yu Su-yuan
收藏  |  浏览/下载：6/0
Thermomechanical properties and thermal cycle resistance of plasma-sprayed mullite coating and mullite/zirconia composite coatings 期刊论文
Ceramics International, 2016, 卷号: 42, 期号: 15, 页码: 17447-17455
作者:  Li SJ(李双建);  Zhao XQ(赵晓琴);  Hou GL(侯国梁);  Deng W(邓雯);  An YL(安宇龙)
收藏  |  浏览/下载：13/0  |  提交时间：2016/11/27
Fabrication and Characterization of Low Stress Si Interposer with Air-gapped Si Interconnection for Hermetical System-in-Package 会议论文
2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), Las Vegas, NV
作者:  Luo, Rongfeng;  Ren, Kuili;  Ma, Shenglin;  Yan, Jun;  Xia, Yanming
收藏  |  浏览/下载：42/0  |  提交时间：2017/01/15
Fabrication and Characterization of Low Stress Si Interposer with Air-gapped Si Interconnection for Hermetical System-in-Package 其他
2016-01-01
Luo, Rongfeng; Ren, Kuili; Ma, Shenglin; Yan, Jun; Xia, Yanming; Jin, Yufeng; Chen, Jing; Wu, Tianzhun; Yang, Hangao; Yuan, Lifang
收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03
Planar lattices with tailorable coefficient of thermal expansion and high stiffness based on dual-material triangle unit 期刊论文
JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS, 2016
Wei, Kai; Chen, Haosen; Pei, Yongmao; Fang, Daining
收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03
Effect of Oxidation-Induced Material Parameter Variation on the High Temperature Oxidation Behavior of Nickel 期刊论文
ACTA MECHANICA SOLIDA SINICA, 2016
Wang, Chao; Ai, Shigang; Fang, Daining
收藏  |  浏览/下载：2/0  |  提交时间：2017/12/03
Preparation of solution-processable colorless polyamide-imides with extremely low thermal expansion coefficients through an in-situ silylation method for potential space optical applications 期刊论文
E-Polymers, 2016, 卷号: 16, 期号: 5, 页码: 395-402
作者:  Wang, Song;  Yang, Guangjie;  Wu, Shibin;  Ren, Ge;  Yang, Wei
收藏  |  浏览/下载：40/0  |  提交时间：2018/06/14

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