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浏览/检索结果: 共6条，第1-6条 帮助 限定条件 发表日期：2016    专题：大连理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Thermomigration-induced asymmetrical precipitation of Ag3Sn plates in micro-scale Cu/Sn-3.5Ag/Cu interconnects 期刊论文 MATERIALS & DESIGN, 2016, 卷号: 89, 页码: 116-120 作者:  Huang, M. L.;  Yang, F.;  Zhao, N. 收藏  |  浏览/下载：6/0  |  提交时间：2019/12/09 Thermomigration  Synchrotron radiation  Crystal growth  Precipitation  Intermetallic compound   On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg solders under thermal gradient 期刊论文 MATERIALS LETTERS, 2016, 卷号: 172, 页码: 211-215 作者:  Kunwar, Anil;  Ma, Haoran;  Ma, Haitao;  Sun, Junhao;  Zhao, Ning 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/09 Thermomigration  Metals and alloys  Diffusion  Synchrotron radiation  Finite element method  Intermetallic alloys and compounds   Novel growth of whole preferred orientation intermetallic compound interconnects for 3D IC packaging 会议论文 66th IEEE Electronic Components and Technology Conference (ECTC), Las Vegas, NV, 2016-05-31 作者:  Huang, M. L.;  Zhang, Z. J.;  Yang, F.;  Zhao, N. 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/09 In situ study on interfacial reactions of Cu/Sn-9Zn/Cu solder joints under temperature gradient 期刊论文 JOURNAL OF ALLOYS AND COMPOUNDS, 2016, 卷号: 682, 页码: 1-6 作者:  Zhao, N.;  Zhong, Y.;  Huang, M. L.;  Dong, W.;  Ma, H. T. 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/09 Synchrotron radiation  Soldering  Thermomigration  Interfacial reaction  Grain orientation  Intermetallic compound   Interfacial reaction of Ni/Sn-9Zn/Ni solder joint undergoing liquid-solid thermomigration 会议论文 17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA, 2016-08-16 作者:  Zhao, Ning;  Deng, Jianfeng;  Zhong, Yi;  Huang, Mingliang;  Ma, Haitao 收藏  |  浏览/下载：6/0  |  提交时间：2019/12/09 Thermomigration  Sn-9Zn  Solder joint  Interfacial reaction  Intermetallic Compound   Cross-solder interaction on interfacial reactions in Ni/Sn-3.0Ag-0.5Cu/Cu solder interconnects 会议论文 17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA, 2016-08-16 作者:  Fan, M.;  Huang, M. L.;  Zhao, N. 收藏  |  浏览/下载：9/0  |  提交时间：2019/12/09 Cross-solder interaction  Synchrotron radiation  liquid-solid interfacial reaction  intermetallic compound