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Spreading process and interfacial characteristic of Sn-17Bi-0.5Cu/Ni at temperatures ranging from 523 K to 673 K 期刊论文
colloids and surfaces a physicochemical and engineering aspects, 2012
Zang, Likun; Yuan, Zhangfu; Zhu, Yuanqing; Xu, Bingsheng; Matsuura, Hiroyuki; Tsukihashi, Fumitaka
收藏  |  浏览/下载:2/0  |  提交时间:2015/11/12
Wettability and interfacial characteristic of Sn-Ag-Cu solder on Ni substrates at elevated temperatures 会议论文
Zanga, Likun; Yuan, Zhangfu; Yan, Hongliang; Li, Xinxue
收藏  |  浏览/下载:2/0  |  提交时间:2015/11/17
基于二维光谱特征空间的土壤线自动提取算法 期刊论文
农业工程学报, 2012
秦其明; 游林; 赵越; 赵少华; 姚云军
收藏  |  浏览/下载:3/0  |  提交时间:2015/11/12


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