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Development of materials design tool and its application in Pb-free micro-solders in electronic package 期刊论文
http://dx.doi.org/10.1007/s11431-010-3199-x, 2010
Liu, X. J.; Wang, C. P.; Ohnuma, I.; Chen, S. L.; Kainuma, R.; Ishida, K.; Chang, A. Y.; 王翠萍
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