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浏览/检索结果: 共5条，第1-5条 帮助 限定条件 发表日期：2006    学科主题：光电子学    内容类型：期刊论文     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Investigation of a chemically treated InP(100) surface during hydrophilic wafer bonding process 期刊论文 materials science and engineering b-solid state materials for advanced technology, 2006, 卷号: 128, 期号: 1-3, 页码: 93-97 作者:  Yu LJ 收藏  |  浏览/下载：68/0  |  提交时间：2010/04/11 surface micro-roughness  contact angle  root-mean-square roughness  SILICON-WAFERS  ROUGHNESS  INP   Optical properties of semiconductor quantum-well material using photonic crystal fabricated by micro-fabrication machine 期刊论文 acta physica sinica, 2006, 卷号: 55, 期号: 3, 页码: 1248-1252 Xu XS; Xiong ZG; Sun ZH; Du W; Lu L; Chen HD; Jin AZ; Zhang DZ 收藏  |  浏览/下载：82/0  |  提交时间：2010/04/11 focused ion beam  electron beam lithography  photonic crystal  extraction efficiency  LIGHT EXTRACTION  SLAB   Bonding-wire compensation effect on the packaging parasitics of optoelectronic devices 期刊论文 microwave and optical technology letters, 2006, 卷号: 48, 期号: 1, 页码: 76-79 Zhu NH; Liu Y; Zhang SJ; Wen JM 收藏  |  浏览/下载：47/0  |  提交时间：2010/04/11 packaging  photodiode  semiconductor laser  S-parameter measurement  DESIGN   Thermal stress analysis for GaInAsP multiple quantum well wafer chemically bonded to Si (100) 期刊论文 journal of applied physics, 2006, 卷号: 100, 期号: 2, 页码: art.no.023513 Zhao HQ (Zhao Hong-Quan); Yu LJ (Yu Li-Juan); Huang YZ (Huang Yong-Zhen) 收藏  |  浏览/下载：35/0  |  提交时间：2010/04/11 ACTIVATED BONDING METHOD  ROOM-TEMPERATURE  EPITAXIAL OVERGROWTHS  SURFACE  CRYSTAL  GAAS  TECHNOLOGY  ENERGY  FILMS   Strain analysis of InP/InGaAsP wafer bonded on Si by X-ray double crystalline diffraction 期刊论文 materials science and engineering b-solid state materials for advanced technology, 2006, 卷号: 133, 期号: 1-3, 页码: 117-123 Zhao HQ (Zhao Hong-Quan); Yu LJ (Yu Li-Juan); Huang YZ (Huang Yong-Zhen); Wang YT (Wang Yu-Tian) 收藏  |  浏览/下载：33/0  |  提交时间：2010/04/11 InP  Si  X-ray double crystalline diffraction  thermal strain  wafer bonding  OPTOELECTRONIC DEVICES  EPITAXIAL OVERGROWTHS  TEMPERATURE  INTERFACE  STRESSES  VCSELS  SURFACES  ENERGY