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长春光学精密机械与物... [1]
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会议论文 [1]
发表日期
2005 [1]
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发表日期:2005
内容类型:会议论文
专题:长春光学精密机械与物理研究所
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Study on LD-pumped Nd:YAG laser cutter (EI CONFERENCE)
会议论文
ICO20: Lasers and Laser Technologies, August 21, 2005 - August 26, 2005, Changchun, China
Cui J.
;
Zhao J.
;
Fan Z.
;
Zhao C.
;
Bi Y.
;
Zhang J.
;
Niu G.
;
Shi Z.
;
Pei B.
;
Zhang G.
;
Xue Y.
;
Qi Y.
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浏览/下载:14/0
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提交时间:2013/03/25
The theory of laser cutter and the technology neck is analyzed. We can conclude that it is almost impossible to deal with the waste thick silicon wafers which are yielded in producing silicon wafers by conventional eroding or diamond cutting
when the cutting velocity equals 100mm/min
while it is also unperfected with ecumenical laser cutter without good beam quality or precise laseroptics system. It is represented that high average power and high repetition rate laser with good beam quality and precise laseroptics system are pivotal to obtain excellent cutting effect such as thick groove depth
double-layer 0.75mm thick silicon wafer can be penetrated.. The cross section is fine and the groove is narrow
rapid cutting speed
the cutting quality meets the expecting demand.
fine kerf section without considering the effect of technique. Considering laser medium thermal lens effect and thermal focal length changing with pumping power
using plano-convex high reflectivity mirror as the back cavity mirror to compensate the heat lens influence
a /4 waveplate to compensate heat -induced birefraction
utilize the Nd:YAG self- aperture effect
more than 50 W average power 1.064 um IR output is obtained with beam quality factor (M2) equals 3.19. Through the LD-Pumped Nd:YAG laser cutter we developed with short focus length negative spherical aberration focusing lens
double axis linear step motor positioning system
suitable beam expander multiplying factor
appropriate diameter of exit beam aperture
proper repetition rate
when the cutting velocity equals 400mm/min
0.75mm thick silicon wafer can be penetrated
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