Simultaneous measurement of thermal conductivity and heat capacity of bulk and thin film materials using frequency-dependent transient thermoreflectance method

CORC > 工程热物理研究所 > 中国科学院工程热物理研究所 > 中国科学院工程热物理所（论文库） > 期刊论文（SCI）

	Simultaneous measurement of thermal conductivity and heat capacity of bulk and thin film materials using frequency-dependent transient thermoreflectance method
	Liu, Jun 1; Zhu, Jie 2; Tian, Miao 1; Gu, Xiaokun 1; Schmidt, Aaron 3; Yang, Ronggui 1
刊名	REVIEW OF SCIENTIFIC INSTRUMENTS
	2013-03-01
卷号	84 期号:3
英文摘要	The increasing interest in the extraordinary thermal properties of nanostructures has led to the development of various measurement techniques. Transient thermoreflectance method has emerged as a reliable measurement technique for thermal conductivity of thin films. In this method, the determination of thermal conductivity usually relies much on the accuracy of heat capacity input. For new nanoscale materials with unknown or less-understood thermal properties, it is either questionable to assume bulk heat capacity for nanostructures or difficult to obtain the bulk form of those materials for a conventional heat capacity measurement. In this paper, we describe a technique for simultaneous measurement of thermal conductivity. and volumetric heat capacity C of both bulk and thin film materials using frequency-dependent time-domain thermoreflectance (TDTR) signals. The heat transfer model is analyzed first to find how different combinations of. and C determine the frequency-dependent TDTR signals. Simultaneous measurement of thermal conductivity and volumetric heat capacity is then demonstrated with bulk Si and thin film SiO2 samples using frequency-dependent TDTR measurement. This method is further testified by measuring both thermal conductivity and volumetric heat capacity of novel hybrid organic-inorganic thin films fabricated using the atomic/molecular layer deposition. Simultaneous measurement of thermal conductivity and heat capacity can significantly shorten the development/discovery cycle of novel materials. (C) 2013 American Institute of Physics. [http://dx.doi.org/10.1063/1.4797479]
WOS标题词	Science & Technology ; Technology ; Physical Sciences
类目[WOS]	Instruments & Instrumentation ; Physics, Applied
研究领域[WOS]	Instruments & Instrumentation ; Physics
关键词[WOS]	MOLECULAR LAYER DEPOSITION ; DIFFERENTIAL SCANNING CALORIMETER ; SURFACE-CHEMISTRY ; TRANSPORT ; INTERFACES ; POLYMERS
收录类别	SCI
语种	英语
WOS记录号	WOS:000316966200038
公开日期	2015-12-22
内容类型	期刊论文
源URL	[http://ir.etp.ac.cn/handle/311046/98895]
专题	工程热物理研究所_中国科学院工程热物理所（论文库）_期刊论文（SCI）
作者单位	1.Univ Colorado, Dept Mech Engn, Boulder, CO 80309 USA 2.Chinese Acad Sci, Inst Engn Thermophys, Beijing 100190, Peoples R China 3.Boston Univ, Dept Mech Engn, Boston, MA 02215 USA
推荐引用方式 GB/T 7714	Liu, Jun,Zhu, Jie,Tian, Miao,et al. Simultaneous measurement of thermal conductivity and heat capacity of bulk and thin film materials using frequency-dependent transient thermoreflectance method[J]. REVIEW OF SCIENTIFIC INSTRUMENTS,2013,84(3).
APA	Liu, Jun,Zhu, Jie,Tian, Miao,Gu, Xiaokun,Schmidt, Aaron,&Yang, Ronggui.(2013).Simultaneous measurement of thermal conductivity and heat capacity of bulk and thin film materials using frequency-dependent transient thermoreflectance method.REVIEW OF SCIENTIFIC INSTRUMENTS,84(3).
MLA	Liu, Jun,et al."Simultaneous measurement of thermal conductivity and heat capacity of bulk and thin film materials using frequency-dependent transient thermoreflectance method".REVIEW OF SCIENTIFIC INSTRUMENTS 84.3(2013).