Enhanced thermal and mechanical properties of polyimide/graphene composites

CORC > 宁波材料技术与工程研究所 > 中国科学院宁波材料技术与工程研究所 > 2014专题

	Enhanced thermal and mechanical properties of polyimide/graphene composites
	Dai, Wen ; Yu, Jinhong ; Wang, Yi ; Song, Yingze ; Bai, Hua ; Nishimura, Kazuhito ; Liao, Huiwei ; Jiang, Nan
刊名	MACROMOLECULAR RESEARCH
	2014
卷号	22 期号:9 页码:983
中文摘要	Polyimide (PI)/graphene sheets (GSs) composites were prepared by solution blending. The incorporation of GSs into PI increased the thermal conductivity, thermal stability and mechanical properties of PI. The thermal conductivity of PI/GSs composites was significantly improved compared with that of neat PI from 0.254 to 1.002 W/mK; this can be attributed to the homogeneous dispersion of graphene and the formation of heat conduction pathway. Furthermore, the Young modulus of PI/GSs was raised up to 4.04 GPa, approximately two-fold enhancement in comparison with that of neat PI. In addition, the incorportation of GSs in PI indicated excellent optical transparency at the lowest weight fractions of GSs and modified wettability of PI films.
公开日期	2015-09-20
内容类型	期刊论文
源URL	[http://ir.nimte.ac.cn/handle/174433/11763]
专题	宁波材料技术与工程研究所_2014专题
推荐引用方式 GB/T 7714	Dai, Wen,Yu, Jinhong,Wang, Yi,et al. Enhanced thermal and mechanical properties of polyimide/graphene composites[J]. MACROMOLECULAR RESEARCH,2014,22(9):983.
APA	Dai, Wen.,Yu, Jinhong.,Wang, Yi.,Song, Yingze.,Bai, Hua.,...&Jiang, Nan.(2014).Enhanced thermal and mechanical properties of polyimide/graphene composites.MACROMOLECULAR RESEARCH,22(9),983.
MLA	Dai, Wen,et al."Enhanced thermal and mechanical properties of polyimide/graphene composites".MACROMOLECULAR RESEARCH 22.9(2014):983.