Super-hydrophobic metal-complex film fabricated electrochemically on copper as a barrier to corrosive medium

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	Super-hydrophobic metal-complex film fabricated electrochemically on copper as a barrier to corrosive medium
	Wang, Peng 1; Zhang, Dun 1; Qiu, Ri 1,2; Wu, Jiajia1,2
刊名	CORROSION SCIENCE
	2014-06-01
卷号	83 页码:317-326
关键词	Copper SEM EIS Interfaces
通讯作者	Zhang, D (reprint author), Chinese Acad Sci, Inst Oceanol, Key Lab Marine Environm Corros & Biofouling, 7 Naihai Rd, Qingdao 266071, Peoples R China.
英文摘要	Metal-complex film with super-hydrophobic property is fabricated on copper (Cu) surface with one-step electrochemical method in laurylamine/ethanol solution. "Dissolution-coordination-precipitation" model is proposed to illuminate formation mechanism of Cu(II)-laurylamine complex film. The super-hydrophobic film can act as a barrier to corrosion of underlying copper with inhibition efficiency close to 100%, and it maintains stability within a wide potential range. The origin of such corrosion protection property is explained from view point that hierarchical micro-structure of the super-hydrophobic film can maintain a stable air/liquid interface which inhibits erosion of corrosive medium. (c) 2014 Elsevier Ltd. All rights reserved.
学科主题	Materials Science; Metallurgy & Metallurgical Engineering
收录类别	SCI
语种	英语
WOS记录号	WOS:000335274700033
内容类型	期刊论文
源URL	[http://ir.qdio.ac.cn/handle/337002/23889]
专题	海洋研究所_海洋腐蚀与防护研究发展中心
作者单位	1.Chinese Acad Sci, Inst Oceanol, Key Lab Marine Environm Corros & Biofouling, Qingdao 266071, Peoples R China 2.Univ Chinese Acad Sci, Beijing 100039, Peoples R China
推荐引用方式 GB/T 7714	Wang, Peng,Zhang, Dun,Qiu, Ri,et al. Super-hydrophobic metal-complex film fabricated electrochemically on copper as a barrier to corrosive medium[J]. CORROSION SCIENCE,2014,83:317-326.
APA	Wang, Peng,Zhang, Dun,Qiu, Ri,&Wu, Jiajia.(2014).Super-hydrophobic metal-complex film fabricated electrochemically on copper as a barrier to corrosive medium.CORROSION SCIENCE,83,317-326.
MLA	Wang, Peng,et al."Super-hydrophobic metal-complex film fabricated electrochemically on copper as a barrier to corrosive medium".CORROSION SCIENCE 83(2014):317-326.