Strain localization and fatigue cracking behaviors of Cu bicrystal with an inclined twin boundary

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	Strain localization and fatigue cracking behaviors of Cu bicrystal with an inclined twin boundary
	L. L. Li ; P. Zhang ; Z. J. Zhang ; H. F. Zhou ; S. X. Qu ; J. B. Yang ; Z. F. Zhang
刊名	Acta Materialia
	2014
卷号	73 页码:167-176
关键词	Cu bicrystal Twin boundary Slip band Fatigue crack Molecular statics coaxial copper bicrystals high-cycle fatigue grain-boundaries crystallographic orientation deformation mechanisms screw dislocations ultrahigh-strength maximum strength single-crystals fcc materials
ISSN号	1359-6454
原文出处	://WOS:000337853100016
语种	英语
公开日期	2015-01-14
内容类型	期刊论文
源URL	[http://ir.imr.ac.cn/handle/321006/73274]
专题	金属研究所_中国科学院金属研究所
推荐引用方式 GB/T 7714	L. L. Li,P. Zhang,Z. J. Zhang,et al. Strain localization and fatigue cracking behaviors of Cu bicrystal with an inclined twin boundary[J]. Acta Materialia,2014,73:167-176.
APA	L. L. Li.,P. Zhang.,Z. J. Zhang.,H. F. Zhou.,S. X. Qu.,...&Z. F. Zhang.(2014).Strain localization and fatigue cracking behaviors of Cu bicrystal with an inclined twin boundary.Acta Materialia,73,167-176.
MLA	L. L. Li,et al."Strain localization and fatigue cracking behaviors of Cu bicrystal with an inclined twin boundary".Acta Materialia 73(2014):167-176.