Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging

	Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging
	Liu, Yang ; Meerwijk, Joost ; Luo, Liangliang ; Zhang, Honglin ; Sun, Fenglian ; Yuan, Cadmus A. ; Zhang, Guoqi
刊名	journal of materials science-materials in electronics
	2014
卷号	25 期号:11 页码:4954-4959
学科主题	半导体器件
收录类别	SCI
语种	英语
公开日期	2015-03-20
内容类型	期刊论文
源URL	[http://ir.semi.ac.cn/handle/172111/26099]
专题	半导体研究所_中科院半导体照明研发中心
推荐引用方式 GB/T 7714	Liu, Yang,Meerwijk, Joost,Luo, Liangliang,et al. Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging[J]. journal of materials science-materials in electronics,2014,25(11):4954-4959.
APA	Liu, Yang.,Meerwijk, Joost.,Luo, Liangliang.,Zhang, Honglin.,Sun, Fenglian.,...&Zhang, Guoqi.(2014).Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging.journal of materials science-materials in electronics,25(11),4954-4959.
MLA	Liu, Yang,et al."Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging".journal of materials science-materials in electronics 25.11(2014):4954-4959.