A new low dielectric material with high thermostability based on a thermosetting trifluoromethyl substituted aromatic molecule

CORC > 上海有机化学研究所 > 中国科学院上海有机化学研究所 > 高分子材料研究室

	A new low dielectric material with high thermostability based on a thermosetting trifluoromethyl substituted aromatic molecule
	He FK(贺凤开) ; Yuan C(袁超) ; Li K(李凯) ; Diao S(刁屾) ; Jin KK(金凯凯) ; Wang JJ(王佳佳) ; Tong JW(童佳伟) ; Ma J(马娟) ; TONG JIAWEI ; MA JUAN ; Fang Q(房强)
刊名	RSC Adv.
	2013
卷号	3 期号:45 页码:23128-23132
ISSN号	2046-2069
其他题名	一种新型高热稳定性的含有三氟甲基芳基的低介电常数材料
通讯作者	房强
英文摘要	A thermally cross-linkable molecule composed of bis(trifluoromethyl) benzene and benzocyclobutene units (F1) was successfully prepared. Heating F1 (>200 degrees C) gave a cured resin, which showed a dielectric constant (k) of 2.47 at 30 MHz and an average
学科主题	高分子化学 ; 氟化学
收录类别	SCI
原文出处	http://dx.doi.org/10.1039/c3ra44991b
语种	英语
WOS记录号	WOS:000326395800060
公开日期	2014-10-16
内容类型	期刊论文
源URL	[http://ir.sioc.ac.cn/handle/331003/29276]
专题	上海有机化学研究所_高分子材料研究室
推荐引用方式 GB/T 7714	He FK,Yuan C,Li K,et al. A new low dielectric material with high thermostability based on a thermosetting trifluoromethyl substituted aromatic molecule[J]. RSC Adv.,2013,3(45):23128-23132.
APA	贺凤开.,袁超.,李凯.,刁屾.,金凯凯.,...&房强.(2013).A new low dielectric material with high thermostability based on a thermosetting trifluoromethyl substituted aromatic molecule.RSC Adv.,3(45),23128-23132.
MLA	贺凤开,et al."A new low dielectric material with high thermostability based on a thermosetting trifluoromethyl substituted aromatic molecule".RSC Adv. 3.45(2013):23128-23132.