Effect of doping Al on the liquid oxidation of Sn-Bi-Zn solder

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	Effect of doping Al on the liquid oxidation of Sn-Bi-Zn solder
	X. J. Wang ; Q. S. Zhu ; B. Liu ; N. Liu ; F. J. Wang
刊名	Journal of Materials Science-Materials in Electronics
	2014
卷号	25 期号:5 页码:2297-2304
关键词	lead-free solder intermetallic compound growth corrosion behavior mechanical-properties cu substrate alloy microstructure reduction aluminum vacuum
ISSN号	0957-4522
原文出处	://WOS:000334411100041
语种	英语
公开日期	2014-07-03
内容类型	期刊论文
源URL	[http://ir.imr.ac.cn/handle/321006/72924]
专题	金属研究所_中国科学院金属研究所
推荐引用方式 GB/T 7714	X. J. Wang,Q. S. Zhu,B. Liu,et al. Effect of doping Al on the liquid oxidation of Sn-Bi-Zn solder[J]. Journal of Materials Science-Materials in Electronics,2014,25(5):2297-2304.
APA	X. J. Wang,Q. S. Zhu,B. Liu,N. Liu,&F. J. Wang.(2014).Effect of doping Al on the liquid oxidation of Sn-Bi-Zn solder.Journal of Materials Science-Materials in Electronics,25(5),2297-2304.
MLA	X. J. Wang,et al."Effect of doping Al on the liquid oxidation of Sn-Bi-Zn solder".Journal of Materials Science-Materials in Electronics 25.5(2014):2297-2304.