Corrosion behavior of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition

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	Corrosion behavior of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition
	M. N. Wang ; J. Q. Wang ; W. Ke
刊名	Journal of Materials Science-Materials in Electronics
	2014
卷号	25 期号:3 页码:1228-1236
关键词	lead-free solders 3.5-percent nacl solution electrochemical corrosion ga solder reliability surface alloys joints tin sn
ISSN号	0957-4522
原文出处	://WOS:000331743200014
语种	英语
公开日期	2014-04-18
内容类型	期刊论文
源URL	[http://ir.imr.ac.cn/handle/321006/72585]
专题	金属研究所_中国科学院金属研究所
推荐引用方式 GB/T 7714	M. N. Wang,J. Q. Wang,W. Ke. Corrosion behavior of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition[J]. Journal of Materials Science-Materials in Electronics,2014,25(3):1228-1236.
APA	M. N. Wang,J. Q. Wang,&W. Ke.(2014).Corrosion behavior of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition.Journal of Materials Science-Materials in Electronics,25(3),1228-1236.
MLA	M. N. Wang,et al."Corrosion behavior of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition".Journal of Materials Science-Materials in Electronics 25.3(2014):1228-1236.