Corrosion behavior of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition | |
M. N. Wang ; J. Q. Wang ; W. Ke | |
刊名 | Journal of Materials Science-Materials in Electronics
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2014 | |
卷号 | 25期号:3页码:1228-1236 |
关键词 | lead-free solders 3.5-percent nacl solution electrochemical corrosion ga solder reliability surface alloys joints tin sn |
ISSN号 | 0957-4522 |
原文出处 | |
语种 | 英语 |
公开日期 | 2014-04-18 |
内容类型 | 期刊论文 |
源URL | [http://ir.imr.ac.cn/handle/321006/72585] ![]() |
专题 | 金属研究所_中国科学院金属研究所 |
推荐引用方式 GB/T 7714 | M. N. Wang,J. Q. Wang,W. Ke. Corrosion behavior of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition[J]. Journal of Materials Science-Materials in Electronics,2014,25(3):1228-1236. |
APA | M. N. Wang,J. Q. Wang,&W. Ke.(2014).Corrosion behavior of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition.Journal of Materials Science-Materials in Electronics,25(3),1228-1236. |
MLA | M. N. Wang,et al."Corrosion behavior of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition".Journal of Materials Science-Materials in Electronics 25.3(2014):1228-1236. |
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