A wafer-level Sn-rich Au–Sn intermediate bonding technique with high strength

	A wafer-level Sn-rich Au–Sn intermediate bonding technique with high strength
	Zhiqiang Fang, Xu Mao, Jinling Yang and Fuhua Yang
刊名	Journal of Micromechanics and Microengineering
	2013
卷号	23 期号:9
学科主题	半导体器件
收录类别	SCI
语种	英语
公开日期	2014-03-26
内容类型	期刊论文
源URL	[http://ir.semi.ac.cn/handle/172111/24560]
专题	半导体研究所_半导体集成技术工程研究中心
推荐引用方式 GB/T 7714	Zhiqiang Fang, Xu Mao, Jinling Yang and Fuhua Yang. A wafer-level Sn-rich Au–Sn intermediate bonding technique with high strength[J]. Journal of Micromechanics and Microengineering,2013,23(9).
APA	Zhiqiang Fang, Xu Mao, Jinling Yang and Fuhua Yang.(2013).A wafer-level Sn-rich Au–Sn intermediate bonding technique with high strength.Journal of Micromechanics and Microengineering,23(9).
MLA	Zhiqiang Fang, Xu Mao, Jinling Yang and Fuhua Yang."A wafer-level Sn-rich Au–Sn intermediate bonding technique with high strength".Journal of Micromechanics and Microengineering 23.9(2013).